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  2. Used for various semiconductor manufacturing presses (ROHM MECHATECH)
Used for various semiconductor manufacturing presses-Pressing type
Used for various semiconductor manufacturing presses-ROHM MECHATECH

Used for various semiconductor manufacturing presses
ROHM MECHATECH

About This Product

■ Realize the package mirror finish of 0.5 μRz

The mold -type surface used for semiconductor packaging requires an ascetic surface that is as close as possible to the mirror surface. By EDM processing, we have realized a mirror surface of 0.5 μRz (0.7 μRY) of the semiconductor package part 30mm square.

■ Rohm Mecatech's technology used in state -of -the -art digital devices

Rohm Mecatech's technology is used in state -of -the -art digital devices such as mobile phones, digital cameras, DVD players, cars, and medical care.

■ Characteristics

Pull out, cut, bend. A mold used for metal precision processing and is used for various semiconductor manufacturing such as LSI, transistor, and diode lead frames.

  • Product

    Used for various semiconductor manufacturing presses

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1 Models of Used for various semiconductor manufacturing presses

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Used for various semiconductor manufacturing presses-Part Number-Pressing type

Pressing type

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About Company Handling This Product

ROHM MECHATECH

Company Overview

ROHM Mechatech Co. Ltd., established in 1988 and based in Kyoto, Japan, is a manufacturer of key components fo...

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