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  1. Metoree
  2. Compatible semiconductor package molds for a wide range of applications (ROHM MECHATECH)
Compatible semiconductor package molds for a wide range of applications-Semiconductor package mold
Compatible semiconductor package molds for a wide range of applications-ROHM MECHATECH

Compatible semiconductor package molds for a wide range of applications
ROHM MECHATECH

About This Product

■ Realize the package mirror finish of 0.5 μRz

The mold -type surface used for semiconductor packaging requires an ascetic surface that is as close as possible to the mirror surface. By EDM processing, we have realized a mirror surface of 0.5 μRz (0.7 μRY) of the semiconductor package part 30mm square.

■ Rohm Mecatech's technology used in state -of -the -art digital devices

Rohm Mecatech's technology is used in state -of -the -art digital devices such as mobile phones, digital cameras, DVD players, cars, and medical care.

■ Characteristics

Precisely designed semiconductor. The mold for semiconductor manufacturing that rates the package requires high accuracy above all. For that reason, ROHM Mecotec focuses on technology development on accuracy. Excellent originality and practicality are highly evaluated in the industry.

  • Product

    Compatible semiconductor package molds for a wide range of applications

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1 Models of Compatible semiconductor package molds for a wide range of applications

Image Part Number Price (excluding tax)
Compatible semiconductor package molds for a wide range of applications-Part Number-Semiconductor package mold

Semiconductor package mold

Available upon quote

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About Company Handling This Product

ROHM MECHATECH

Company Overview

ROHM Mechatech Co. Ltd., established in 1988 and based in Kyoto, Japan, is a manufacturer of key components fo...

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