Compatible semiconductor package molds for a wide range of applications (ROHM MECHATECH)
Compatible semiconductor package molds for a wide range of applications
ROHM MECHATECH
This product is registered by ROHM MECHATECH.
About This Product
■ Realize the package mirror finish of 0.5 μRz
The mold -type surface used for semiconductor packaging requires an ascetic surface that is as close as possible to the mirror surface. By EDM processing, we have realized a mirror surface of 0.5 μRz (0.7 μRY) of the semiconductor package part 30mm square.
■ Rohm Mecatech's technology used in state -of -the -art digital devices
Rohm Mecatech's technology is used in state -of -the -art digital devices such as mobile phones, digital cameras, DVD players, cars, and medical care.
■ Characteristics
Precisely designed semiconductor. The mold for semiconductor manufacturing that rates the package requires high accuracy above all. For that reason, ROHM Mecotec focuses on technology development on accuracy. Excellent originality and practicality are highly evaluated in the industry.
This is the version of our website addressed to speakers of English in
the United States.
If you are a resident of another country, please select the appropriate version of Metoree for your country in the drop-down menu.
