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  4. Low-Modulus One-Component Epoxy Adhesive Combining Flexibility and Heat Resistance Technodyne AH UK Series (Taoka Chemical Co., Ltd.)
Low-Modulus One-Component Epoxy Adhesive Combining Flexibility and Heat Resistance Technodyne AH UK Series-AH2062UK
Low-Modulus One-Component Epoxy Adhesive Combining Flexibility and Heat Resistance Technodyne AH UK Series-AH2182UK
Low-Modulus One-Component Epoxy Adhesive Combining Flexibility and Heat Resistance Technodyne AH UK Series-AH22T3UK
Low-Modulus One-Component Epoxy Adhesive Combining Flexibility and Heat Resistance Technodyne AH UK Series-AH2042UK-2
Low-Modulus One-Component Epoxy Adhesive Combining Flexibility and Heat Resistance Technodyne AH UK Series-Taoka Chemical Co., Ltd.

Low-Modulus One-Component Epoxy Adhesive Combining Flexibility and Heat Resistance Technodyne AH UK Series
Taoka Chemical Co., Ltd.

💻 Electronics & Electrical Use 🚗 Automotive & Transport Use

About This Product

■A proprietary resin design gives this epoxy adhesive a well-balanced combination of

flexibility and heat resistance, two properties that normally conflict. Even in environments involving thermal loads and changes in shape, it does not place excessive stress on the bonded interface and delivers stable bonding performance.

■ Crack Resistance

Excellent at relieving stress caused by differences in coefficient of linear expansion, it is effective in preventing cracks during thermal shock testing.

■ Vibration Absorption

Excellent vibration damping and quietness across a wide temperature range.

■ Heat Resistance

Offers heat resistance suitable for use in automotive electronic components*. *Also has a track record of adoption in components subject to AEC-Q standards Applications

■ Fixing/encapsulating electronic components

■ Fixing acoustic components (speaker magnets, voice coils)

■ Fixing automotive DC motor components

Ideal for bonding dissimilar materials and for use in environments subject to vibration. *Data in this document are representative values obtained under specific conditions and are not specification (guaranteed) values.

  • Product

    Low-Modulus One-Component Epoxy Adhesive Combining Flexibility and Heat Resistance Technodyne AH UK Series

  • Usage Scenarios

    Electronics & Electrical Use / Automotive & Transport Use

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4 Models of Low-Modulus One-Component Epoxy Adhesive Combining Flexibility and Heat Resistance Technodyne AH UK Series

Click on the part number for more information about each product

Image Part Number Price (excluding tax) Thixotropic Index Elastic Modulus (DMA method, 25°C) (MPa) Bond Strength (LCP) (25°C) (N/mm2) Bond Strength (Steel) (25°C) (N/mm2) Curing Conditions Viscosity (25°C) (Pa·s) Development Status
Low-Modulus One-Component Epoxy Adhesive Combining Flexibility and Heat Resistance Technodyne AH UK Series-Part Number-AH2062UK

AH2062UK

Available upon quote

2

220

7

11

120°C/60min

60

Production product

Low-Modulus One-Component Epoxy Adhesive Combining Flexibility and Heat Resistance Technodyne AH UK Series-Part Number-AH2182UK

AH2182UK

Available upon quote

2

260

7

8

120°C/60min

40

Development product

Low-Modulus One-Component Epoxy Adhesive Combining Flexibility and Heat Resistance Technodyne AH UK Series-Part Number-AH22T3UK

AH22T3UK

Available upon quote

3

- -

11

120°C/60min

100

Development product

Low-Modulus One-Component Epoxy Adhesive Combining Flexibility and Heat Resistance Technodyne AH UK Series-Part Number-AH2042UK-2

AH2042UK-2

Available upon quote

2

40

-

7

120°C/60min

50

Development product

Click on the part number for more information about each product

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Taoka Chemical Co., Ltd.

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