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Product
[Development Product] Flame-Retardant, High Heat-Resistant, Thermally Conductive, Low-Temperature Curing One-Component Epoxy Adhesive Technodyne AHHandling Company
Taoka Chemical Co., Ltd.Categories
Usage Scenarios
Electronics & Electrical Use / Automotive & Transport UseClick on the part number for more information about each product
| Image | Part Number | Price (excluding tax) | CTE (Tg and below) (ppm/°C) | Glass Transition Temperature (Tg) (TMA method) (°C) | Bond Strength (25°C) (PBT) (N/mm2) | Bond Strength (25°C) (Steel) (N/mm2) | Thermal Conductivity | Curing Conditions | Viscosity (25°C) Pa·s |
|---|---|---|---|---|---|---|---|---|---|
|
[Development Product] AH80T3WF |
Available upon quote |
|
|
|
19 |
|
110°C/60min |
150-200 |
|
[Development Product] AH8041KF |
Available upon quote | - | - | - |
18 |
- |
110°C/60min |
40 |
|
[Development Product] AH7932K |
Available upon quote |
70 |
150 |
- |
28 |
- |
135°C/120min |
100 |
|
AH3021WH [Production Product] |
Available upon quote |
80 |
120 |
- |
29 |
- |
130°C/30min |
30 |
|
[Development Product] AH91T1AK |
Available upon quote |
40 |
130 |
- |
19 |
1.1 W/(m・K) |
110°C/30min |
80-160 |
|
[Development Product] AH6052K |
Available upon quote | - |
115-120 |
2 |
10-12 |
- |
70°C/60min 80°C/40min |
50 |
Click on the part number for more information about each product
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Reviews shown here are reviews of companies.