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  4. [Development Product] Flame-Retardant, High Heat-Resistant, Thermally Conductive, Low-Temperature Curing One-Component Epoxy Adhesive Technodyne AH
  5. [Development Product] AH6052K
[Development Product] Flame-Retardant, High Heat-Resistant, Thermally Conductive, Low-Temperature Curing One-Component Epoxy Adhesive Technodyne AH-Taoka Chemical Co., Ltd.

[Development Product] AH6052K | [Development Product] Flame-Retardant, High Heat-Resistant, Thermally Conductive, Low-Temperature Curing One-Component Epoxy Adhesive Technodyne AH
Taoka Chemical Co., Ltd.

💻 Electronics & Electrical Use 🚗 Automotive & Transport Use

Price (excluding tax)

Estimate Required

Model Description

Low-temperature curing (70°C to 80°C)

Model Filter

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Bond Strength (25°C) (PBT) (N/mm2)

Bond Strength (25°C) (Steel) (N/mm2)

CTE (Tg and below) (ppm/°C)

Curing Conditions

Glass Transition Temperature (Tg) (TMA method) (°C)

Thermal Conductivity

Viscosity (25°C) Pa·s

See all 6 models in list

  • Part Number

    [Development Product] AH6052K

  • Usage Scenarios

    Electronics & Electrical Use / Automotive & Transport Use

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[Development Product] Flame-Retardant, High Heat-Resistant, Thermally Conductive, Low-Temperature Curing One-Component Epoxy Adhesive Technodyne AH [Development Product] AH6052K's performance table

Image Price (excluding tax) Bond Strength (25°C) (PBT) (N/mm2) Bond Strength (25°C) (Steel) (N/mm2) Curing Conditions Glass Transition Temperature (Tg) (TMA method) (°C) Viscosity (25°C) Pa·s
[Development Product] Flame-Retardant, High Heat-Resistant, Thermally Conductive, Low-Temperature Curing One-Component Epoxy Adhesive Technodyne AH-Part Number-[Development Product] AH6052K Available upon quote 2 10-12 70°C/60min 80°C/40min 115-120 50

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Taoka Chemical Co., Ltd.

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Glue

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