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  4. Liquid Silicone Thermal Interface Material, Two-Part Thermal Potting Compound TPS586 (Japan Shiu Li Technology Co., Ltd.)
Liquid Silicone Thermal Interface Material, Two-Part Thermal Potting Compound TPS586-TPS586
Liquid Silicone Thermal Interface Material, Two-Part Thermal Potting Compound TPS586-Japan Shiu Li Technology Co., Ltd.

Liquid Silicone Thermal Interface Material, Two-Part Thermal Potting Compound TPS586
Japan Shiu Li Technology Co., Ltd.

About This Product

■Overview

LiPOLY's TPS series are two-part potting adhesives that can be cured at room temperature or at elevated temperature. They can fill the gaps in the space around electronic components. After curing, they adhere closely to heat-generating electronic components and heat sinks, conducting heat while the electronic product operates at high power. It is a gap filler with a thermal conductivity of 0.8 to 3.0 W/m*K.

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    Liquid Silicone Thermal Interface Material, Two-Part Thermal Potting Compound TPS586

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1 Models of Liquid Silicone Thermal Interface Material, Two-Part Thermal Potting Compound TPS586

Image Part Number Price (excluding tax)
Liquid Silicone Thermal Interface Material, Two-Part Thermal Potting Compound TPS586-Part Number-TPS586

TPS586

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Japan Shiu Li Technology Co., Ltd.

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