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  4. Liquid Non-Silicone Thermal Interface Material, Non-Silicone Two-Part Potting Adhesive EP770-s (Japan Shiu Li Technology Co., Ltd.)
Liquid Non-Silicone Thermal Interface Material, Non-Silicone Two-Part Potting Adhesive EP770-s-EP770-s
Liquid Non-Silicone Thermal Interface Material, Non-Silicone Two-Part Potting Adhesive EP770-s-Japan Shiu Li Technology Co., Ltd.

Liquid Non-Silicone Thermal Interface Material, Non-Silicone Two-Part Potting Adhesive EP770-s
Japan Shiu Li Technology Co., Ltd.

About This Product

■Overview

LiPOLY's EP770-s is a non-silicone two-part potting adhesive that can be cured at room temperature or at elevated temperature. It can fill the gaps in the space around electronic components. After curing, it adheres closely to heat-generating electronic components and heat sinks, conducting heat while the electronic product operates at high power. Because there is no volatilization of low-molecular-weight siloxanes, contact failures in electronic circuits do not occur. It is suitable for use with optical products and sensitive electronic components.

■What Are Low-Molecular-Weight Siloxanes

Their chemical formula is that of polyalkylsiloxane, Ho-[Si (CH3) 2O]n-H. Because they are volatile, when an electronic product is installed in a sealed space, low-molecular-weight siloxanes cause contact failures in electronic components.

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    Liquid Non-Silicone Thermal Interface Material, Non-Silicone Two-Part Potting Adhesive EP770-s

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1 Models of Liquid Non-Silicone Thermal Interface Material, Non-Silicone Two-Part Potting Adhesive EP770-s

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Liquid Non-Silicone Thermal Interface Material, Non-Silicone Two-Part Potting Adhesive EP770-s-Part Number-EP770-s

EP770-s

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