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  4. Liquid Non-Silicone Thermal Interface Material, Non-Silicone Two-Part Thermal Potting Compound NEP220 (Japan Shiu Li Technology Co., Ltd.)
Liquid Non-Silicone Thermal Interface Material, Non-Silicone Two-Part Thermal Potting Compound NEP220-NEP220
Liquid Non-Silicone Thermal Interface Material, Non-Silicone Two-Part Thermal Potting Compound NEP220-Japan Shiu Li Technology Co., Ltd.

Liquid Non-Silicone Thermal Interface Material, Non-Silicone Two-Part Thermal Potting Compound NEP220
Japan Shiu Li Technology Co., Ltd.

About This Product

■Overview

LiPOLY's NEP220 and NEP230 are non-silicone two-part adhesives that can be cured at room temperature or at elevated temperature. They offer advantages such as low stress, high thermal conductivity, low viscosity, and electrical insulation. Because there is no volatilization of low-molecular-weight siloxanes, contact failures in electronic circuits do not occur. They are suitable for use with optical products and sensitive electronic components. Using the dispenser we developed, they are suitable products for automated production lines.

■What Are Low-Molecular-Weight Siloxanes

Their chemical formula is that of polyalkylsiloxane, Ho-[Si (CH3) 2O]n-H. Because they are volatile, when an electronic product is installed in a sealed space, low-molecular-weight siloxanes cause contact failures in electronic components.

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    Liquid Non-Silicone Thermal Interface Material, Non-Silicone Two-Part Thermal Potting Compound NEP220

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1 Models of Liquid Non-Silicone Thermal Interface Material, Non-Silicone Two-Part Thermal Potting Compound NEP220

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Liquid Non-Silicone Thermal Interface Material, Non-Silicone Two-Part Thermal Potting Compound NEP220-Part Number-NEP220

NEP220

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Japan Shiu Li Technology Co., Ltd.

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