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Conductive Adhesive TK Paste Sintering Type CM-4230
KAKEN TECH CO., LTD.


About This Product

"TK Paste CM-4230", a highly conductive, highly heat-transferring silver paste that sinters at low temperature, is a lead-free, high heat dissipation die bonding paste. It supports pressureless sintering in an N2 atmosphere, and sintering at 200°C is possible in air. Densification by heating under pressure is also possible.

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    Conductive Adhesive TK Paste Sintering Type CM-4230

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1 Models of Conductive Adhesive TK Paste Sintering Type CM-4230

Image Part Number Price (excluding tax) Storage Volume Resistivity Thermal Conductivity Application Curing Conditions Viscosity

CM-4230

Available upon quote

Frozen (-10°C or below)

5x10^-8 Ω·cm

170 W/m·K

Die bonding

60°C x 60 min + 200°C x 60 min (in air)

51 Pa·s

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