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XCSW compound / semiconductor crystal FZ method SiliconwehaHandling Company
Tours Co., Ltd.Categories
Click on the part number for more information about each product
Image | Part Number | Price (excluding tax) | Training method | Conductive | Direction | φ diameter (inch) | Resistance value (Ω ・ cm) | diameter | thickness | Primary flat length | Primary flat oriented | Secondary flat length | Secondary flat direction | TTV | BOW | Warp | Surface finishing | LPD | Back | Chipping |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
FZ-Si |
Available upon quote |
Fz |
N or p |
<100> or <111> |
3 ~ 8 |
> 1,000 |
150 ± 0.5mm |
675 ± 15um |
57.5 ± 2.5mm |
<001> ± 1 ° |
none |
none |
≦ 5 um |
≦ 40um |
≦ 40um |
Chemical mechanical polishing |
≧ 0.3um at ≦ 15pcs |
Etched |
none |
|
NTDFZ-SI |
Available upon quote |
NTDFZ |
N |
<100> or <111> |
3 ~ 8 |
30-800 |
150 ± 0.5mm |
675 ± 15um |
57.5 ± 2.5mm |
<001> ± 1 ° |
none |
none |
≦ 5 um |
≦ 40um |
≦ 40um |
Chemical mechanical polishing |
≧ 0.3um at ≦ 15pcs |
Etched |
none |
|
Gdfz-si |
Available upon quote |
Gdfz |
N or p |
<100> or <111> |
3 ~ 8 |
0.001 ~ 300 |
150 ± 0.5mm |
675 ± 15um |
57.5 ± 2.5mm |
<001> ± 1 ° |
none |
none |
≦ 5 um |
≦ 40um |
≦ 40um |
Chemical mechanical polishing |
≧ 0.3um at ≦ 15pcs |
Etched |
none |
Click on the part number for more information about each product
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