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XCSW compound / semiconductor crystal epitaxial wafer base plateHandling Company
Tours Co., Ltd.Click on the part number for more information about each product
Image | Part Number | Price (excluding tax) | Training method | diameter | Substrate thickness | Thickness of the membrane layer | Conductive | Direction | Surface finishing | Dopant | Density | Olifra | XRD FWHM | Effective range | LT-GAAS Epi layer thickness | Low -temperature growth temperature | Substrate surface direction | Micro defect density | Resistance value (300k) | Carrier concentration | Main board | Film layer | PL wavelength | distortion | Epitaxial layer | Thick thickness | EDP |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Sapphire substrate for LD, LED Gan |
Available upon quote |
MOCVD |
φ50.8mm |
430um |
0.2 ~ Um |
- | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
Sapphire substrate ALN |
Available upon quote | - |
φ50.8mm |
- |
1um ± 10% |
Semi -insulter |
C axis (0001) ± 1 ° |
none |
- | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
Sapphire board INGAN |
Available upon quote | - |
φ50.8mm |
- |
100 to 200um |
- |
C axis (0001) ± 1 ° |
One -sided or double -sided epiledic polishing |
In |
> 108cm⁻⁻ |
- | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
Sapphire substrate ALGAN |
Available upon quote | - |
φ50.8mm |
- |
1um ± 10% |
Semi -insulter |
C side |
- | - | - |
A -side |
<200arcsec |
> 90% |
- | - | - | - | - | - | - | - | - | - | - | - | - | |
GaaS board for THZ detection LT-GAAS |
Available upon quote | - |
φ50.8mm |
350um, 500um |
- |
UNDOPED/Semiplantation |
- | - | - |
<1x106cm⁻⁻ |
- | - |
≧ 80% |
1 ~ 3um |
200-250 ° C |
-100 |
≦ 5cm⁻⁻ |
> 108OHM-CM |
<0.5ps |
- | - | - | - | - | - | - | |
INP board for PIN INGAAS |
Available upon quote | - |
φ50.8mm |
- | - | - | - | - |
FE (semi -insulter) |
<1x10^⁴/cm^² |
- | - | - | - | - |
-100 |
- |
> 1x10^⁷Ohm.cm |
- | - | - | - | - | - | - | - | |
1.55UMQW for laser INP board INGAASP/INGAAS |
Available upon quote |
MOCVD |
φ50.8mm |
- | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
S Dope INP |
INGAASP/INGAAS |
1,500 ± 3 ~ 5nm |
-1.0 ± 0.1% |
8 ~ 20 |
1.0 ~ 3.0um |
- | |
GaaS substrate ALAS |
Available upon quote | - |
φ50.8mm |
350um |
- |
N or P (semi -insulator) * Selectable |
- | - | - | - | - | - | - | - | - | - | - | - |
> E18Ω.cm (regardless of the conductive type) |
Gaas |
GaaS and Alas |
- | - | - | - | - | |
INP substrate INGAAS/INP |
Available upon quote | - |
φ50.8mm |
350 ± 25um |
- |
N |
(100) ± 0.5 ° |
Single -sided polishing, back -side etched SEMI compliant |
S |
- | - | - | - | - | - | - | - | - | - |
Inp |
- | - | - | - | - |
<1E4/cm² |
|
GAN substrate INGAAS/INP |
Available upon quote | - |
φ50.8mm |
350um |
- |
N |
(100) ± 0.5 ° |
- |
S |
- | - | - | - | - | - | - | - | - | - |
Gan |
- | - | - | - | - |
<1E4/cm² |
Click on the part number for more information about each product
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