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  2. Excellent cutting semiconductor wafer surface diamond wheel (TOKYO DIAMOND TOOLS MFG.CO.,LTD.)
Excellent cutting semiconductor wafer surface diamond wheel-Diamond wheel for semiconductor wafers
Excellent cutting semiconductor wafer surface diamond wheel-TOKYO DIAMOND TOOLS MFG.CO.,LTD.

Excellent cutting semiconductor wafer surface diamond wheel
TOKYO DIAMOND TOOLS MFG.CO.,LTD.

TOKYO DIAMOND TOOLS MFG.CO.,LTD.'s Response Status

Response Rate

100.0%

Response Time

22.3hours

Relatively Fast Response

About This Product

■ Features

・ Silicon wafer -filled wheels provide “ME” bonds with excellent sharpness and high groove -shaped maintenance. The finishing surface is also good, reducing the amount of polish after chamfering, reducing the total processing cost by reducing the time of the postage and the reduction of consumables. ・ SIC -Sapphire Waha Heavy wheels offer a bond specification wheels with excellent sharpness and excellent grinding. For small amounts and medium -quantum production, we can also provide an electroded bond surface wheel. ・ LT / LN Waha's surface wheels provide bond specifications that suppress the occurrence of wafing of wafers with brittle. ・ In addition to general R -shaped (round full round) and T -type grooves, we will also support special shapes such as left and right asymmetric shapes.

■ Applicable material for diamond surface wheels

Silicon, SIC (silicon carbide / silicon carbide), sapphire, LT (lithium / lithium tantalate), LN (lithium niovate), GAN (gallium nitride / gallium night ride), GAAS (galium arsenic), Ishigami. * 1 Roughly finished -integrated wheels can be made * 2 Please contact us for other sizes * 3 Please contact us for other tolerance * 4 Depending on the groove shape, it is possible as much as 10 grooves.

  • Product

    Excellent cutting semiconductor wafer surface diamond wheel

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1 Models of Excellent cutting semiconductor wafer surface diamond wheel

Image Part Number Price (excluding tax) Granularity * 1 Outside diameter * 2 Inner diameter * 3 Dynamic balance Groove angle tolerance Number of gaps * 4 Bond type
Excellent cutting semiconductor wafer surface diamond wheel-Part Number-Diamond wheel for semiconductor wafers

Diamond wheel for semiconductor wafers

Available upon quote

#400 ~#3,000

φ102, φ202

H6 tolerance

≧ 0.1g @min.

Course difference ≧ 0.5 degrees (one corner)

~ 10

Metal bond

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About Company Handling This Product

TOKYO DIAMOND TOOLS MFG.CO.,LTD.

Response Rate

100.0%

Response Time

22.3hrs

Company Overview

Tokyo Diamond Tools Mfg. Co., Ltd. is a diamond tools manufacturer established in 1932 and based in Tokyo, Jap...

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