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  2. Compound semiconductor wafer plane grinding "Vega" Vitri Fide Bond Wheel (TOKYO DIAMOND TOOLS MFG.CO.,LTD.)
Compound semiconductor wafer plane grinding "Vega" Vitri Fide Bond Wheel-Vega
Compound semiconductor wafer plane grinding "Vega" Vitri Fide Bond Wheel-TOKYO DIAMOND TOOLS MFG.CO.,LTD.

Compound semiconductor wafer plane grinding "Vega" Vitri Fide Bond Wheel
TOKYO DIAMOND TOOLS MFG.CO.,LTD.

TOKYO DIAMOND TOOLS MFG.CO.,LTD.'s Response Status

Response Rate

100.0%

Response Time

22.3hours

Relatively Fast Response

About This Product

■ Realization of high -quality processing surface by flat grinding such as SIC substrates for compound semiconductor

・ Realizes a high -quality grinding surface by combining a ultra -fine diamond and a vitrafide bond with a combination tissue of large -diameter pores and micro -holes. ・ By adopting a bond that realizes ultra -fine crushing, the self -produced blade in the minimum unit is realized, and the sharpness continues. ・ Stable high -quality surface is obtained, and processing costs are reduced

■ Long life of wheels in [rough processing] of SIC wafer plane grinding

Our vigorous hole Vitribondo wheel "Vega" is a new bond wheel developed by its own whetstone tissue control technology. In particular, the processing and wheel life is balanced by the cracked chopping of SIC Waha's flat grinding. The 6 -inch SIC Waha is also non -dress and can be processed. Excellent wear resistance increases the number of wafes that can be processed per wheel, contributing to reducing the processing cost of wafers.

■ Features

・ Significantly improves life expectancy from conventional products (wheel wear rate of 15%or less) ・ Achieved stable processing at 0.6 μm/sec ・ Lineup of two types, which emphasizes grinding and life span ・ Achievements in the Balkwake Haha crafting process (SI side), the wafer back grind (C side) in the device process ・ After grinding, surface roughness RA17NM-20nm

  • Product

    Compound semiconductor wafer plane grinding "Vega" Vitri Fide Bond Wheel

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1 Models of Compound semiconductor wafer plane grinding "Vega" Vitri Fide Bond Wheel

Image Part Number Price (excluding tax)
Compound semiconductor wafer plane grinding "Vega" Vitri Fide Bond Wheel-Part Number-Vega

Vega

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About Company Handling This Product

TOKYO DIAMOND TOOLS MFG.CO.,LTD.

Response Rate

100.0%

Response Time

22.3hrs

Company Overview

Tokyo Diamond Tools Mfg. Co., Ltd. is a diamond tools manufacturer established in 1932 and based in Tokyo, Jap...

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