Compound semiconductor wafer plane grinding "Vega" Vitri Fide Bond Wheel-Vega

Compound semiconductor wafer plane grinding "Vega" Vitri Fide Bond Wheel
TOKYO DIAMOND TOOLS MFG.CO.,LTD.

About This Product

■ Realization of high -quality processing surface by flat grinding such as SIC substrates for compound semiconductor・ Realizes a high -quality grinding surface by combining a ultra -fine diamond and a vitrafide bond with a combination tissue of large -diameter pores and micro -holes.
・ By adopting a bond that realizes ultra -fine crushing, the self -produced blade in the minimum unit is realized, and the sharpness continues.
・ Stable high -quality surface is obtained, and processing costs are reduced

■ Long life of wheels in [rough processing] of SIC wafer plane grindingOur vigorous hole Vitribondo wheel "Vega" is a new bond wheel developed by its own whetstone tissue control technology. In particular, the processing and wheel life is balanced by the cracked chopping of SIC Waha's flat grinding. The 6 -inch SIC Waha is also non -dress and can be processed. Excellent wear resistance increases the number of wafes that can be processed per wheel, contributing to reducing the processing cost of wafers.

■ Features・ Significantly improves life expectancy from conventional products (wheel wear rate of 15%or less)
・ Achieved stable processing at 0.6 μm/sec
・ Lineup of two types, which emphasizes grinding and life span
・ Achievements in the Balkwake Haha crafting process (SI side), the wafer back grind (C side) in the device process
・ After grinding, surface roughness RA17NM-20nm

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There is 1 model available for this product.

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Compound semiconductor wafer plane grinding "Vega" Vitri Fide Bond Wheel

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TOKYO DIAMOND TOOLS MFG.CO.,LTD.

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1 Models of Compound semiconductor wafer plane grinding "Vega" Vitri Fide Bond Wheel

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	Vega	Available upon quote

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About Company Handling This Product

TOKYO DIAMOND TOOLS MFG.CO.,LTD.

Company Overview

Tokyo Diamond Tools Mfg. Co., Ltd. is a diamond tools manufacturer established in 1932 and based in Tokyo, Jap...

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Compound semiconductor wafer plane grinding "Vega" Vitri Fide Bond Wheel TOKYO DIAMOND TOOLS MFG.CO.,LTD.

About This Product

■ Realization of high -quality processing surface by flat grinding such as SIC substrates for compound semiconductor

■ Long life of wheels in [rough processing] of SIC wafer plane grinding

■ Features

1 Models of Compound semiconductor wafer plane grinding "Vega" Vitri Fide Bond Wheel

Vega

Other products of TOKYO DIAMOND TOOLS MFG.CO.,LTD.

About Company Handling This Product

Compound semiconductor wafer plane grinding "Vega" Vitri Fide Bond Wheel
TOKYO DIAMOND TOOLS MFG.CO.,LTD.