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  4. High-speed, high-precision 3D/2D/SD wafer bump automatic inspection system RWi-300MK3 (Nidek Advanced Technology Co., Ltd.)
High-speed, high-precision 3D/2D/SD wafer bump automatic inspection system RWi-300MK3-RWi-300MK3
High-speed, high-precision 3D/2D/SD wafer bump automatic inspection system RWi-300MK3-Nidek Advanced Technology Co., Ltd.

High-speed, high-precision 3D/2D/SD wafer bump automatic inspection system RWi-300MK3
Nidek Advanced Technology Co., Ltd.

About This Product

■Features ・Realizes simultaneous 3D/2D/SD measurement at high speed and with high accuracy ・Ideal for 3D inspection of gold bumps ・Various conveyance systems ■High Accuracy Significantly improved 2D/3D measurement accuracy ■High Speed Achieving ultra-high-speed inspection ■High Performance Review (defects) Image acquisition speed dramatically improved

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    High-speed, high-precision 3D/2D/SD wafer bump automatic inspection system RWi-300MK3

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1 Models of High-speed, high-precision 3D/2D/SD wafer bump automatic inspection system RWi-300MK3

Product Image Part Number Price (excluding tax)
High-speed, high-precision 3D/2D/SD wafer bump automatic inspection system RWi-300MK3-Part Number-RWi-300MK3

RWi-300MK3

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Nidek Advanced Technology Co., Ltd.

  • Japan

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