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High-speed, high-precision 3D/2D/SD wafer bump automatic inspection system RWi-300MK3-RWi-300MK3
High-speed, high-precision 3D/2D/SD wafer bump automatic inspection system RWi-300MK3-Nidek Advanced Technology Co., Ltd.

High-speed, high-precision 3D/2D/SD wafer bump automatic inspection system RWi-300MK3
Nidek Advanced Technology Co., Ltd.


About This Product

■Features

・Realizes simultaneous 3D/2D/SD measurement at high speed and with high accuracy ・Ideal for 3D inspection of gold bumps ・Various conveyance systems

■High Accuracy

Significantly improved 2D/3D measurement accuracy

■High Speed

Achieving ultra-high-speed inspection

■High Performance

Review (defects) Image acquisition speed dramatically improved

  • Product

    High-speed, high-precision 3D/2D/SD wafer bump automatic inspection system RWi-300MK3

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1 Models of High-speed, high-precision 3D/2D/SD wafer bump automatic inspection system RWi-300MK3

Image Part Number Price (excluding tax)
High-speed, high-precision 3D/2D/SD wafer bump automatic inspection system RWi-300MK3-Part Number-RWi-300MK3

RWi-300MK3

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