Sputtering equipment
Arios Co., Ltd.
About This Product
■Summary
A film deposition system that uses sputtering (often abbreviated as sputtering). A feature of sputtering film formation is that the particles that fly to the substrate have relatively high energy, making it possible to create a strong film with high adhesion. On the other hand, since plasma is created using argon or other materials and this acts on the substrate, problems such as roughening of the substrate surface may occur.
This device is a sputtering device that uses magnetron discharge and is compatible with ultra-high vacuum. For research and development applications, the compact design saves space. Ideal for prototyping and experimentation, and easy to use. There is also a compact sputtering device (SS-DC RF301) that is more convenient, space-saving, and easy to use.
■Features
・Since it is a small sputtering device, it is easy to use.
・You can choose from two types depending on the specifications.
・A wide variety of options are available, allowing you to choose from a variety of options.
- Load lock system allows stable film formation.
■Cathode
・RF magnetron sputtering
・DC magnetron sputtering
*Photos of the 2-inch cathode and 1-inch cathode are posted in Introduction Part 2: Small sputtering equipment. It is also possible to include your specified sputtering source in the specifications.
■Options
・Substrate heating mechanism
・Substrate rotation mechanism
・RF application unit for pre-sputtering
・Mass flow
・Diversification
・Changing board size
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Product
Sputtering equipment
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Handling Company
Arios Co., Ltd.
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Categories
1 Models of Sputtering equipment
| Product Image | Part Number | Price (excluding tax) | Board size | Device configuration | Exhaust system | Gas introduction system | Leak rate | Membrane pressure distribution | Output display monitor output | RF power supply ⁄ DC power supply | Ultimate pressure | Vacuum gauge |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Sputtering equipment |
Available upon quote | Φ50mm (standard) | Film formation room + exchange room |
Deposition chamber: 200 L⁄sec TMP + scroll pump Exchange room: Scroll pump (with foreline trap) |
1 system | 1×10^-10 Pa・m^3⁄sec or less | Within ±5% within φ50mm board | 800W 0~5V DC linear output with analog meter | 0~300W |
Deposition chamber: 1×10^-5 Pa or less Exchange room: 1 Pa or less |
Deposition chamber: Full range gauge Capacitance gauge Exchange room: Pirani gauge |
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About Company Handling This Product
- Japan