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  4. Sputtering equipment (Arios Co., Ltd.)
Sputtering equipment-Sputtering equipment
Sputtering equipment-Arios Co., Ltd.

Sputtering equipment
Arios Co., Ltd.

Arios Co., Ltd.'s Response Status

Response Rate

100.0%

Response Time

1.7hours

Very Fast Response

About This Product

■Summary

A film deposition system that uses sputtering (often abbreviated as sputtering). A feature of sputtering film formation is that the particles that fly to the substrate have relatively high energy, making it possible to create a strong film with high adhesion. On the other hand, since plasma is created using argon or other materials and this acts on the substrate, problems such as roughening of the substrate surface may occur. This device is a sputtering device that uses magnetron discharge and is compatible with ultra-high vacuum. For research and development applications, the compact design saves space. Ideal for prototyping and experimentation, and easy to use. There is also a compact sputtering device (SS-DC RF301) that is more convenient, space-saving, and easy to use.

■Features

・Since it is a small sputtering device, it is easy to use. ・You can choose from two types depending on the specifications. ・A wide variety of options are available, allowing you to choose from a variety of options. - Load lock system allows stable film formation.

■Cathode

・RF magnetron sputtering ・DC magnetron sputtering *Photos of the 2-inch cathode and 1-inch cathode are posted in Introduction Part 2: Small sputtering equipment. It is also possible to include your specified sputtering source in the specifications.

■Options

・Substrate heating mechanism ・Substrate rotation mechanism ・RF application unit for pre-sputtering ・Mass flow ・Diversification ・Changing board size

  • Product

    Sputtering equipment

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1 Models of Sputtering equipment

Image Part Number Price (excluding tax) Device configuration Membrane pressure distribution Vacuum gauge Exhaust system Board size Ultimate pressure Output display monitor output Leak rate Gas introduction system RF power supply ⁄ DC power supply
Sputtering equipment-Part Number-Sputtering equipment

Sputtering equipment

Available upon quote

Film formation room + exchange room

Within ±5% within φ50mm board

Deposition chamber: Full range gauge Capacitance gauge
Exchange room: Pirani gauge

Deposition chamber: 200 L⁄sec TMP + scroll pump
Exchange room: Scroll pump (with foreline trap)

Φ50mm (standard)

Deposition chamber: 1×10^-5 Pa or less
Exchange room: 1 Pa or less

800W 0~5V DC linear output with analog meter

1×10^-10 Pa・m^3⁄sec or less

1 system

0~300W

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About Company Handling This Product

Arios Co., Ltd.

Response Rate

100.0%

Response Time

1.7hrs

  • Japan

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