Small sputtering equipment SS-DC RF301-SS-DC RF301
Small sputtering equipment SS-DC RF301-Arios Co., Ltd.

Small sputtering equipment SS-DC RF301
Arios Co., Ltd.


About This Product

■Summary Small sputtering equipment SS-DC RF301 This is a film forming equipment that uses sputtering (often abbreviated as sputtering). A feature of sputtering film formation is that the particles that fly to the substrate have relatively high energy, making it possible to create a strong film with high adhesion. On the other hand, since plasma is created using argon or other materials and this acts on the substrate, problems such as roughening of the substrate surface may occur. This device is a small sputtering device equipped with one 2" magnetron cathode and one substrate heating mechanism. All functions are packed into a JIS rack size in pursuit of space saving and ease of use. In addition, it is a UHV with an exchange room. Compatible types of sputtering equipment are also available. ■Features ・Although it is small, it has specifications and performance equivalent to full-scale sputtering equipment. - Compact, lightweight, and simple design allows installation in approximately half the space of an office desk. - The distance between the target and the board can be set arbitrarily using the board up/down mechanism. ・Substrate heating can be performed at high temperatures. - Equipped with a chiller as standard, it can be operated using only electricity and gas. - The flanges are compatible and can be rearranged into sputter-up and sputter-down. - Either DC or RF can be selected as the sputtering power source.

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    Small sputtering equipment SS-DC RF301

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1 Models of Small sputtering equipment SS-DC RF301

Product Image Part Number Price (excluding tax) Board stage Board up/down mechanism Cathode Cathode cooling method Cathode power supply Cathode target material Cathode target size Exhaust system Gas supply system Leak amount Main body stand Size Substrate heating temperature Ultimate pressure Utilities Nitrogen gas (for purge) Utility Process gas Utility power Vacuum gauge Weight
Small sputtering equipment SS-DC RF301-Part Number-SS-DC RF301

SS-DC RF301

Available upon quote 2 inch compatible stage Stroke 100mm Manual operation O-ring shaft seal Magnetron cathode Water-cooled (equipped with chiller) DC output 500W or RF output 300W Various mechanical chuck methods or bonding methods 2 inches TMP + diaphragm pump MFC1 system (Ar) 1/4 SwagelokTM or VCRTM connection 1×10^-8 Pa・m^3/sec or less (excluding O-ring transmission) With caster adjuster W540×D600 H1280 (excluding connector parts, etc.) MAX 500℃ (MAX 800℃ available as an option) 3×10^-4 Pa or less 0.05~0.1 MPa (1/4 SwagelokTM or 1/4 VCRTM) Ar (1/4 SwagelokTM or 1/4 VCRTM) AC200V single phase 20A) Full range vacuum gauge (cold cathode + Pirani gauge) Approximately 100kg

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