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■SMF01 series ・It has a stable cubic shape, and because it uses a sponge core material, it is soft and has excellent properties. - Can be manufactured in medium and large sizes compared to silicone and metal grounding terminals. - Soft sponge material prevents the PCB from warping or deforming the device.
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Compression decompression rate
Core material
Features
Operating temperature
Outer skin
Recommended size
Resistance value
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SMF01Product
Automatic mounting gasketHandling Company
E-SONG EMC CO., LTD.Categories
Image | Price (excluding tax) | Compression decompression rate | Core material | Features | Operating temperature | Outer skin | Recommended size | Resistance value |
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Available upon quote | >90% | Heat resistant PU sponge | Uses soft materials Suitable for medium-sized devices such as home appliances | -40~+105℃ | Conductive PI film | Thickness 3.0~25.0mm | <0.1Ω |
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