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10 products found
YAC GARTER CO .,LTD
160+ people viewing
An auto reel changer is a device that connects to a taping machine and automatically winds carrier tape and changes reels. Reel replacement automat...
YAC GARTER CO .,LTD
150+ people viewing
Last viewed: 1 day ago
This equipment is installed in production equipment for semiconductors, electronic components, etc., and performs appearance and dimensional inspec...
YAC GARTER CO .,LTD
110+ people viewing
Last viewed: 1 day ago
This is a device that classifies chip LEDs supplied from parts feeders into ranks based on the results of electrical and optical inspection. One de...
YAC GARTER CO .,LTD
110+ people viewing
Last viewed: 8 hours ago
This is a device that probes the backside of LEDs supplied from parts feeders and classifies them into ranks based on the electrical and optical in...
YAC GARTER CO .,LTD
130+ people viewing
Last viewed: 9 hours ago
This is a manual insertion machine exclusively for embossed carrier tape that has excellent cost performance and is suitable for taping a wide vari...
YAC GARTER CO .,LTD
160+ people viewing
Last viewed: 1 day ago
This is a device that tapes only non-defective devices supplied from parts feeders based on the results of electrical and visual inspection. Taking...
YAC GARTER CO .,LTD
150+ people viewing
Last viewed: 23 hours ago
This is a device that tapes only non-defective devices supplied from wafer rings based on the results of electrical property and appearance inspect...
YAC GARTER CO .,LTD
170+ people viewing
Last viewed: 1 day ago
This is a device that tapes only non-defective devices fed from a tray based on the electrical characteristics and appearance inspection results. B...
YAC GARTER CO .,LTD
130+ people viewing
Last viewed: 2 hours ago
This is a taping device that repacks devices supplied from a tape feeder (reel) after re-inspecting them. We can re-inspect devices that have defec...
YAC GARTER CO .,LTD
150+ people viewing
Last viewed: 1 day ago
This equipment performs visual inspections for chipping, cracks, foreign objects, etc. that occur on chips on wafers during the pre-process of semi...