Nidek Advanced Technology Co., Ltd.'s PCB Inspection Equipment

20 registered PCB Inspection Equipment of Nidek Advanced Technology Co., Ltd.

Nidek Advanced Technology Co., Ltd.

Automatic electrical inspection equipment Touch panel/FPC inspection equipment NRFEIS-5060

Open/μ short/leak inspection device for multi-sided FPC For large sheet type FPC. Achieves high throughput. NRFEIS-5060 series is the next generat...

Nidek Advanced Technology Co., Ltd.

Optical inspection equipment Optical automatic inspection equipment for semiconductor packages RSH-120

Next-generation IC substrate bump inspection equipment Supports simultaneous inspection of 3D bump height and appearance of next-generation IC sub...

Nidek Advanced Technology Co., Ltd.

Optical inspection equipment Optical automatic inspection equipment for semiconductor packages RSH-230

Next-generation IC substrate bump inspection equipment Measures board warpage at ultra-high speed. Supports simultaneous inspection of 3D bump hei...

Nidek Advanced Technology Co., Ltd.

3D measuring device for glass substrate NSAT Series 3D Head

High-speed, high-precision 3D measurement device compatible with next-generation substrates ■Features ・Depth 5μm, compatible with LineSpace2/2 ・...

Nidek Advanced Technology Co., Ltd.

3D measuring device for glass substrates NSAT Series SR&ABF Thickness Module

High-speed, high-precision 3D measurement device compatible with next-generation substrates ■Features ・Depth 5μm, compatible with LineSpace2/2 ・...

Nidek Advanced Technology Co., Ltd.

2D/3D inspection equipment for high-density substrates RSH Series RSH-4

■Features ・Ultra high speed and high precision inspection ・2D/3D simultaneous measurement system ・Supports finer bump diameter/pitch

Nidek Advanced Technology Co., Ltd.

2D/3D inspection equipment for high-density substrates RSH Series RSH-12

■Features ・Ultra high speed and high precision inspection ・2D/3D simultaneous measurement system ・Supports finer bump diameter/pitch

Nidek Advanced Technology Co., Ltd.

2D/3D inspection equipment for high-density substrates RSH Series RSH-23

■Features ・Ultra high speed and high precision inspection ・2D/3D simultaneous measurement system ・Supports finer bump diameter/pitch

Nidek Advanced Technology Co., Ltd.

High-speed, high-precision 3D/2D/SD wafer bump automatic inspection system RWi-300MK3

■Features ・Realizes simultaneous 3D/2D/SD measurement at high speed and with high accuracy ・Ideal for 3D inspection of gold bumps ・Various conve...


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