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3 products found
Musashino Denshi, INC.
1140+ people viewing
Last viewed: 1 day ago
Polishing and cutting hot melt temporary anticipated adhesive. It is used to adhere to various materials such as semiconductors, magnetic materials...
2 models listed
Musashino Denshi, INC.
580+ people viewing
Last viewed: 12 hours ago
Polishing and cutting hot melt temporary anticipated adhesive. Ideal for polishing, grinding, and cutting work with weak alkaline solution. ■ Feat...
Musashino Denshi, INC.
670+ people viewing
Last viewed: 13 hours ago
It is the best adhesive for work with Diamond Wire Saw. It does not dissolve in oily and water -based cutting solutions. ■ Features ・ There is hi...