4 registered Glue of Musashino Denshi, INC.
Musashino Denshi, INC.
Polishing and cutting hot melt temporary anticipated adhesive. It is used to adhere to various materials such as semiconductors, magnetic materials...
Musashino Denshi, INC.
It is the best adhesive for work with Diamond Wire Saw. It does not dissolve in oily and water -based cutting solutions. ■ Features ・ There is hi...
Musashino Denshi, INC.
Polishing and cutting hot melt temporary anticipated adhesive. Ideal for polishing, grinding, and cutting work with weak alkaline solution. ■ Feat...