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This section provides an overview for wire bonders as well as their applications and principles. Also, please take a look at the list of 15 wire bonder manufacturers and their company rankings. Here are the top-ranked wire bonder companies as of February, 2025: 1.Questar Products International, Inc., 2.KAIJO corporation, 3.Anza.
Table of Contents
A wire bonder is a device used to electrically bond a large number of I/O electrodes to the substrate side of integrated circuits such as IC chips and LSI chips. Wire bonders are also used to connect electrodes between printed circuit boards.
Although flip chip bonders have been widely used for mounting integrated circuits in recent years, there is still a need for wire bonding.
There are two types of wire bonders: the manual type, in which bonding is performed while observing the bonding with a microscope, and the fully automatic type, in which the bonding address is programmed in advance.
Wire bonders are mainly used in the assembly process, which is the back-end process of the semiconductor manufacturing process. The manual type described above is used for experimental and prototype board circuits, while fully automated wire bonders are used in the mass production process.
Wire bonders require high productivity because they connect electrodes on a one-to-one basis. For this reason, products that connect wires at a high speed of about 0.05p/s per wire bonding location have become mainstream.
Ultra-thin wires made of gold, aluminum, copper, or other materials are used to connect electrodes on the substrate and integrated circuits. Ultrasonic welding technology is used to bond each electrode and wire, and bonding is completed in a very short time. The part where the wires are passed and joined is called the head, of which there are several types depending on its structure.
Since wire bonders require wire bonding between extremely tiny electrodes, the positioning accuracy is extremely precise, requiring an accuracy error of ±2 microns. It also requires precise management and control of the pressing load (bonding load) of the head and is equipped with a non-rebound servo mechanism and anti-vibration system that suppresses external vibrations to achieve high positioning accuracy.
The wire bonding process can be broadly classified into two categories: wire bonding and wire bonding.
Wire bonding can be roughly classified into two methods: ball bonding, in which electric discharge is generated between the wire and electrode, forming a ball-shaped molten part on both sides, followed by pressure bonding while applying heat or ultrasonic waves, in which the wire is directly pressed by ultrasonic waves onto the electrode without forming a ball-shaped molten part. There is a method called wedge bonding, in which the wire is pressed directly to the electrode without forming a ball-shaped melted portion, using ultrasonic waves.
There is a wide range of wire diameters from tens of microns to several hundred microns in ribbon wire, and the bonding method must be selected according to the wire.
*Including some distributors, etc.
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Questar Products International, Inc., Founded in 1983, was establishedas a manufacturer specialized industry machinery. The company is headquartered in Pleasanton, CA, where it strategically operates to provide performance-oriented packaging services tailored to the waste industry. Questar's comprehensive offerings encompass a range of solutions, including rated containers, drums, pails, and totes, all designed to address diverse waste packaging needs. With a strong urge to meeting packaging requirements, Questar Products International is directed to serving enterprises seeking efficient and effective packaging solutions.
Palomar Technologies, Inc., Established in 1975, is a manufacturer of precision automation equipment specializing in microelectronics assembly and packaging solutions. The company offers a range of products, including die attach solutions, wire bonding equipment, and optoelectronic packaging systems. With a global captivity, Palomar Technologies has solidified its position as a key player in the industry, providing cutting-edge technology for various applications. the company's Wide range of products has made them a preferred choice among those seeking advanced assembly solutions.
WestBond, Inc. was founded in 1966 and is based in Dunn, North Carolina as a manufacturer of wire bonding and die attach machines, wire pull and shear test equipment, ultrasonic components, and accessories for the microelectronics packaging industry. Since its inception, the company has specialized in manufacturing quality semiconductor wire bonders, die bonders, wedge bonders, and related equipment. The company's expertise also extends to wire pull and shear test equipment, ultrasonic components, and various accessories. WestBond serves customers both domestically and internationally.
Shibuya Corporation, founded in 1931, is a Japan-based manufacturer and retailer of industrial systems and equipment. Their product portfolio is available in various categories, including packaging plant business, mechatronics, agricultural and regenerative medicine. The packaging plant segment includes various equipment and systems used in the bottling, packaging, food processing and pharmaceutical industries. The agricultural division includes grading & analyzing systems such as fruit, welsh onion, and flowering plant grading systems. The mechatronics system segment includes medical equipment such as dialysis systems, medical lasers, and UV Light treatment systems. The division also includes semiconductor manufacturing and cutting processing systems.
Minder-Hightech Co.,ltd, established in 2014 and headquartered in Guangzhou, China, emerged as a manufacturer specializing in automation solutions. Its product portfolio encompasses automatic soldering machines, dispensing robots, and screw fastening machines, serving industries such as electronics, automotive, medical, consumer goods, and packaging. Its products are designed to streamline manufacturing processes including soldering, dispensing adhesives, and screw fastening. The machining workshop features lathes, grinders, wire cutting, drilling machines, and more, offering fixture design, production, and sample services.
Kaijo Corporation is a manufacturer of industrial cleaners that originated from Kaijo, Japan. The company started as a maker of fish finders and echo sounders and in 1957, they started manufacturing their first ultrasonic cleaners. They now have two lines of ultrasonic cleaning equipment and systems as well as a range of specialty products and applications. Their main office is located in Tokyo, Japan, with four international offices in China, Taiwan, the United States, and Germany.
TPT Wire Bonder, established 1996, is a manufacturer of wire bonders and die bonders in the field of wire bonding technology. The company specializes in the development and production of semi-automatic wire bonders, catering to the microelectronics sector. With a wealth of experience in wire bonding and die bonding technology, TPT Wire Bonder GmbH and Co. KG offering both manual and semi-automatic wire bonding machines since its establishment. The company's advancing microelectronics applications makes them a good partner for those seeking wire bonding solutions.
Kulicke and Soffa Industries, Inc., founded in Philadelphia, Pennsylvania, in 1951 is a manufacturer of semiconductor and electronics assembly solutions. The company's product portfolio includes advanced Packaging (Hybrid), Ball Bonders, Die Attaches, Electronics Assemblies and Wafer Level Bonders. Their products are used in markets such as automotive, communications, computer, consumer, and data storage. The company provides services such as Product Selection Guidance, Engineering Support, New Product Design and Development and Custom Manufacturing.
F & K DELVOTEC Bondtechnik GmbH, founded in 1978, is a manufacturer headquartered in Ottobrunn, Germany, specializing in assembly and joining technologies for semiconductor and microelectronics manufacturing. F & K DELVOTEC develops technology and solutions for manual, partial, and full automation of wire bonding. The company also provides services covering machine selection and configuration, buffer station and magazine coupling, as well as feeding system integration for various industries, including the semiconductor, automotive, and photovoltaic sectors. Recognizing the growing demand for power electronics, the company also develops laser bonding technology to join aluminum and copper ribbons on direct copper bonding (DCB) substrates.
Micro Point Pro Ltd, founded in 2010 and formerly the micro-swiss wedge and die attach tool division of Kulicke and Soffa Industries, Inc. (K&S), is a manufacturer based in Yokne'am Illit, Israel, specializing in the front-end and back-end of semiconductor manufacturing. In 2016, MPP acquired K&S's manual wire bonder division, enabling the company to become an Original Equipment Manufacturer (OEM) of manual wire bonders. MPP provides probe head technology for resistivity tests on wafers, along with high-precision expendable tools for packaging processes in the microelectronic industry. The company’s tools and solutions find application in the medical, aerospace, and semiconductor sectors.
Hesse GmbH, established in 1995 and headquartered in Paderborn, Germany, is a global manufacturer specializing in fully automatic ultrasonic bonding and welding machines as well as laser welding systems, software for monitoring ultrasonic-bond-processes and customized tools and machines. The company offers various products, including fine wire bonding, heavy wire bonding, and thermosonic wire bonding with subsidiaries in Hong Kong, USA and Japan. The company serves industrial companies engaged in assembly and connection technology, including semiconductor manufacturers, HF/RF, automotive, battery systems suppliers, and medical.
Ultrasonic Engineering Co.,Ltd., founded in 1956 and based in Tokyo, Japan, is a manufacturer of electrical equipment, machinery, and supplies among others. The company has 186 patents and offers a wide range of products including cltrasonic wire bonders, ultrasonic cleaners, ultrasonic plastic welders, ultrasonic metal bonders, and ultrasonic measuring instruments among others. The company serves various industries including chemicals & pharmaceuticals, paper & printing, transport & logistics, textiles, and many more.
DIAS Automation, Established between 1990s to 2000s, to excel as a manufacturer and supplier, specializes in servicing automation equipment for the semiconductor and electronics industries. With streamlining processes, the company delivers cutting-edge automation technologies to enhance efficiency across industries. DIAS Automation's automation is evident through its comprehensive range of automation products and services, designed to meet diverse operational needs. With a customer-centric approach, the company's solutions cater to businesses seeking to optimize its operations through advanced automation.
FandS Bondtec Austria, Founded in 1994 by Dr. F. Farassat and Dipl. Ing. S. Kazemi, is a key manufacturer and supplier in the wirebonding industry. The company traces its roots to the expertise of its founders, boasting a collective experience of over a century. Originally established with wirebonding specialists from the AEG-Telefunken production facility, the company has grown to become a name in the field. The company's Austria target on wirebond processes and technology positions it as a pioneer in the semiconductor and electronic component manufacturing domain.
ANZA Inc, Established in 1980, offers its services as a manufacturer, supplier, or distributor in the Financial Services industry, based in Watertown, South Dakota. With its operational headquarters situated in this region, ANZA Inc employs a workforce of 251-500 individuals and boasts revenue ranging from $50 million to $100 million. The company's significant mark in the financial sector is reflected in its consistent performance. ANZA Inc's offerings adds up to this industry's growth, serving as a paartner to financial solutions and services.
Ranking as of February 2025
Derivation Method| Rank | Company | Click Share |
|---|---|---|
| 1 | Questar Products International, Inc. |
15.0%
|
| 2 | KAIJO corporation |
12.5%
|
| 3 | Anza |
10.7%
|
| 4 | Palomar Technologies |
8.0%
|
| 5 | Kulicke and Soffa Industries, Inc. |
7.3%
|
| 6 | SHIBUYA CORPORATION |
6.6%
|
| 7 | Minder-Hightech Co.,ltd |
6.3%
|
| 8 | WestBond, Inc. |
5.9%
|
| 9 | Hesse |
5.6%
|
| 10 | DIAS Automation |
5.6%
|
Derivation Method
The ranking is calculated based on the click share within the wire bonder page as of February 2025. Click share is defined as the total number of clicks for all companies during the period divided by the number of clicks for each company.Number of Employees
Newly Established Company
Company with a History
*Including some distributors, etc.
*Including some distributors, etc.
| Country | Number of Companies | Share (%) |
|---|---|---|
|
United States of America
|
3 | 23.1% |
|
Germany
|
3 | 23.1% |
|
Japan
|
2 | 15.4% |
|
China
|
2 | 15.4% |
|
Taiwan
|
1 | 7.7% |
|
Israel
|
1 | 7.7% |
|
Austria
|
1 | 7.7% |
23 products found
23 products
TPT Japan Co., Ltd.
100+ people viewing
Last viewed: 11 hours ago
■Pursuing high precision bonding and operability - Can be used for both wedge bond and ball bond, making it ideal for prototype development ・High ...
TPT Japan Co., Ltd.
110+ people viewing
Last viewed: 22 hours ago
■Complete functions and stable bonding ・Ideal for prototype development as it can be used for both wedge bond and ball bond. ・Control the loop he...
TPT Japan Co., Ltd.
100+ people viewing
Last viewed: 22 hours ago
■Focus on price with minimum functions ・Ideal for prototype development as it can be used for both wedge bond and ball bond. ・Excellent cost perf...
Yamaha Robotics Holdings Co., Ltd.
120+ people viewing
Last viewed: 9 hours ago
■Features ・By using wire bonder UTC-5000 as a base, high-speed bonding of 30ms/bump is achieved. ・Equipped with a wafer rotation stage, it is pos...
TPT Japan Co., Ltd.
80+ people viewing
Last viewed: 22 hours ago
■Desktop wedge bonder for thick wires ・Compact and highly functional tabletop thick wire wedge bonder ・Loop shape control ・Easy operation with t...
TPT Japan Co., Ltd.
80+ people viewing
Last viewed: 3 hours ago
■High-precision pick and placer with a variety of functions HB75 has been remodeled from the wire bonder HB series as a pick and placer based on cu...
HiSOL,Inc.
170+ people viewing
Last viewed: 22 hours ago
Standard Response
■Summary Model 7KE is a tabletop multi-wire bonder that can be used for both ball bonding and wedge bonding. Equipped with the latest vertical driv...
Yamaha Robotics Holdings Co., Ltd.
130+ people viewing
Last viewed: 9 hours ago
■Summary ・High-speed Cu wire bonder that is the culmination of the series ・Upgraded version of multi-wire compatible model that supports Cu wire,...
HiSOL,Inc.
150+ people viewing
Last viewed: 2 hours ago
Standard Response
■Summary The ultrasonic wedge wire bonder E series is a tabletop manual wedge wire bonder with a vertically driven X-Y-Z 3-axis manipulator (patent...
Yamaha Robotics Holdings Co., Ltd.
170+ people viewing
Last viewed: 9 hours ago
■Summary ・High-speed wire bonder that is the culmination of the series ・Upgraded version of basic model for gold wire bonding ・Improve device fu...
HiSOL,Inc.
180+ people viewing
Last viewed: 7 hours ago
Standard Response
■Summary Model 7476D (7600D specification) is a tabletop manual wedge wire bonder. Equipped with a new mechanism X-Y-Z 3-axis manipulator (patented...
Yamaha Robotics Holdings Co., Ltd.
110+ people viewing
■Summary ・High-speed Cu wire bonder that is the culmination of the series ・Upgraded version of wide frame compatible model compatible with 100mm ...
Yamaha Robotics Holdings Co., Ltd.
120+ people viewing
Last viewed: 9 hours ago
■Summary High-speed wire bonder compatible with wide frames and suitable for LED and discrete production. ■Features - Renewed X, Y, and Z motors f...
HiSOL,Inc.
240+ people viewing
Last viewed: 22 hours ago
Standard Response
■Summary Model 7700D is a tabletop manual ball wire & bump bonder. Equipped with a new mechanism X-Y-Z 3-axis manipulator (patented) as standard, i...
HiSOL,Inc.
180+ people viewing
Last viewed: 4 hours ago
Standard Response
■Summary Model 7476D (7400D specification) is a tabletop manual wedge wire bonder. Equipped with a new mechanism X-Y-Z 3-axis manipulator (patented...
HiSOL,Inc.
120+ people viewing
Last viewed: 7 hours ago
Standard Response
■Summary Model 7372E is a tabletop multi-die bonder equipped with two functions: a eutectic die bonder that mounts chips using a eutectic material ...
HiSOL,Inc.
180+ people viewing
Last viewed: 8 hours ago
Standard Response
■Summary Model 4KE is a semi-automatic multi-wire bonder that can be used for both ball bonding and wedge bonding. The Y-axis and Z-axis are motor...
HiSOL,Inc.
150+ people viewing
Last viewed: 8 hours ago
Standard Response
■Summary Model 4546E is a semi-automatic multi-wedge wire bonder. The Y-axis and Z-axis are motor-controlled, allowing you to freely control the l...
HiSOL,Inc.
130+ people viewing
Last viewed: 7 hours ago
Standard Response
A desktop wire bonder and die bonder ideal for failure analysis applications. Since it is operated using an X-Y-Z 3-axis manipulator (patented), it...
Orte Corporation Co., Ltd.
280+ people viewing
Last viewed: 9 hours ago
■ Characteristics ・ EFO torch (electrode torch) is used in the wire bonding process. ・ We design and provide a wide range of EFO torches for wire...
