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9 products found
Nikka Seiko Co., Ltd.
190+ people viewing
Last viewed: 13 hours ago
Standard Response
With its strong adhesive strength, it is suitable for small-sized cutting and grinding, and is suitable for stable high-load cutting with less clog...
Nikka Seiko Co., Ltd.
190+ people viewing
Last viewed: 2 minutes ago
Standard Response
Like shift wax, it is suitable for processing various materials due to its high-precision adhesion, and because it is poorly soluble in alkali, it ...
Nikka Seiko Co., Ltd.
90+ people viewing
Last viewed: 13 hours ago
Standard Response
The Aqua Liquid series is an environmentally friendly water-soluble wax that uses water as a solvent. It can be used by applying it to a plate in t...
Nikka Seiko Co., Ltd.
140+ people viewing
Last viewed: 8 hours ago
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There are types that can be cleaned with hot water and types that can be cleaned with room temperature water, improving the working environment and...
Nikka Seiko Co., Ltd.
100+ people viewing
Last viewed: 12 hours ago
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Astro Liquid is a liquid wax that was developed as a temporary fixing wax during back grinding of patterned semiconductor device wafers, and the th...
Nikka Seiko Co., Ltd.
160+ people viewing
Last viewed: 1 hour ago
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A wax capable of high-precision bonding that can be used for a wide range of processing such as cutting, cutting, and polishing various materials. ...
Nikka Seiko Co., Ltd.
160+ people viewing
Last viewed: 13 hours ago
Standard Response
The SKY LIQUID series is ideal for coating with automounters and spin coaters, meeting the needs for high precision wafer production with high flat...
Nikka Seiko Co., Ltd.
170+ people viewing
Last viewed: 9 hours ago
Standard Response
This wax boasts a long history of trust and performance, mainly for grinding and polishing processes. It has a wide variety of softening points and...
Nikka Seiko Co., Ltd.
100+ people viewing
Last viewed: 13 hours ago
Standard Response
Space Liquid is a newly developed high softening point, chemical resistant liquid wax for temporary fixing during back grinding of patterned wafers...
