High-output fiber laser processing unit TLFD-100
Takei Electric Industry
About This Product
It is a laser processing unit that combines the simplicity and versatility like a laser marker and the full -fledged performance.
Feature
･ Processing unit developed easier to use with high -output 100W processing capacity
･ Compact the laser oscillator, digital galvanoschana, and control
･ Beautiful processing with less heat effects (pulse width: 20/30 / 60 / 120nsec can be switched)
･ High level of processing position accuracy (position reproducibility of 1 μm or less)
･ Processing while transporting the work by coordinating with the encoder signal
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Product
High-output fiber laser processing unit TLFD-100
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Handling Company
Takei Electric Industry
1 Models of High-output fiber laser processing unit TLFD-100
| Product Image | Part Number | Price (excluding tax) | Applicable electronic components | Application Mobile touch panel | Application car | Basic specification Garvanoscanalesa optical scanning speed | Basic specification laser average output | Basic specification laser pulse width | Basic specification laser wavelength | Basic specifications Garbanoschana Focusing area/processing area | Basic specifications Garvanoschana Repeated position | Basic specifications laser laser type | Basic specifications laser maximum pulse energy | Basic specifications laser repetitive frequency range | General specification device body weight | General specification equipment conditions | General specification input voltage | General specification maximum pulse energy | General specification power consumption (under processing) | General specifications Environmental resistance peripheral temperature | General specifications Use of environment -resistant peripheral humidity | General specifications attached equipment | Materials to be processed metal sheet metal foil | Processing applications | Processing material fragile material | Use 5g | Use battery (battery) |
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TLFD-100 |
Available upon quote | Print / marking of parts | Print / marking to parts | Removal of motor hairpin | Up to 3,000mm/sec or more | 100 (W) | Variable 20/30/60/120 (NSEC) | 1,064 (NM) | Custom supportable | ± 1 μm (scanning area 100 × 100nm) | Fiber laser | 1.0 (MJ) | 50 ~ 1,000 (KHz) (pulse width 20or30nsec) | Approximately 18kg (head part) | Dust, toxic gas, water drops, oil, electromagnetic waves, indoor rooms | Single -phase AC100 ~ 240V50/60Hz | 1.0 (MJ) | 700va | 15 ~ 30 ° C | 70%RH or less without condensation | Control box, embedded PC | Iron, copper, stainless steel, aluminum, steel | Copper foil thickness 50 μm cut, stainless steel thickness 50 μm cut, aluminum thickness is 40 μm precision cut, ceramic hole diameter 300 μm, hairpin enamel peeling, circuit formation 30 μm pitch, metal thin film pattern putting 30 μm pitch, metal paste putterning 30 μm pitch, copper thickness 50 μm diameter 300 μm. , AI thickness 40 μm hole diameter 300 μm, aluminum thickness 40 μm hole diameter 300 μm, copper surface paint trimming, transparent conductive film pattern patterning 30 μm pitch, aluminum thickness is 40 μm, copper thickness is 100 μm, and aluminum thickness is about 100 μm. | Ceramix substrate, silicon substrate, GAN board | Escape of the wire film | Laser cut of electrode metal foil |
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