IR wavelength 100w Pico second laser ultra-short pulse laser processing unit TLFD-100P
Takei Electric Industry
About This Product
Ultra -short pulse laser processing is an ultra -precision process that suppresses heat damage by pulse irradiation of a very short time from pico seconds to ceramics, metal foil, glass, resin, etc. In addition to the absolute processing capacity of high -output 100W, it can be used from R & D on a mass production line with a position reproducibility of 1 μm or less by a digital encoder.
Feature
･ IR wavelength 100w pico second laser with small heat effect when processed
･ High output authentic fiber laser 100W
･ Position reproducibility of 1 μm or less by digital encoder
･ The simplicity of all -in -one
･ Precision processing is possible such as ceramics, metal foil, glass, resin, etc.
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Product
IR wavelength 100w Pico second laser ultra-short pulse laser processing unit TLFD-100P
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Handling Company
Takei Electric Industry
1 Models of IR wavelength 100w Pico second laser ultra-short pulse laser processing unit TLFD-100P
| Product Image | Part Number | Price (excluding tax) | Industrial food packaging | Industry | Industry Mobile Touch Panel | Industry display | Industry high -performance film | Industry medicine | Industry semiconductor/LED | Practical example glass | Practical examples Ceramics | Target material fragile material | Target material metal sheet metal foil | Target material resin film |
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TLFD-100P |
Available upon quote | Packing film fine holes | ・ Display film cutting ・ Fine holes ・ Serramix parts screen ・ Cut / microscopic hole | ・ Film cutting ・ Fine hole drilling ・ Ceramix parts screen ・ Cut / microtation hole | ・ Clamping film cutting ・ Fine holes ・ Serramix parts screen ・ Cut / microscopic hole | Laminated film fine hole | ・ Medical film disconnection ・ Fine holes ・ Seramix parts screen ・ Cut / microscopic hole | ・ Film cutting ・ Fine hole drilling ・ Ceramix parts screen ・ Cut / microtation hole | Inner marking thickness 1.2mm | Cut / surface processing thickness 0.7mm | ・ Ceramics substrate, silicone substrate, SIC substrate, GAN substrate, glass board | ・ Iron, copper, stainless steel, aluminum, steel | ・ PI (polyimide) ・ PET (polyethylene telephate) ・ PP (polypropylene) ・ PE (polyethylene) ・ COP (ring olefin polymer) ・ TAC (triastylcellulose) ・ PMMA (acrylic) |
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