High-output fiber laser processing unit TLFD-100-TLFD-100

High-output fiber laser processing unit TLFD-100
Takei Electric Industry

About This Product

It is a laser processing unit that combines the simplicity and versatility like a laser marker and the full -fledged performance.


Feature
･ Processing unit developed easier to use with high -output 100W processing capacity
･ Compact the laser oscillator, digital galvanoschana, and control
･ Beautiful processing with less heat effects (pulse width: 20/30 / 60 / 120nsec can be switched)
･ High level of processing position accuracy (position reproducibility of 1 μm or less)
･ Processing while transporting the work by coordinating with the encoder signal

Model
There is 1 model available for this product.

Product
High-output fiber laser processing unit TLFD-100

Handling Company
Takei Electric Industry

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1 Models of High-output fiber laser processing unit TLFD-100

Image	Part Number	Price (excluding tax)	Basic specifications laser laser type	Basic specification laser average output	Basic specifications laser maximum pulse energy	Basic specification laser wavelength	Basic specification laser pulse width	Basic specifications laser repetitive frequency range	Basic specifications Garvanoschana Repeated position	Basic specification Garvanoscanalesa optical scanning speed	Basic specifications Garbanoschana Focusing area/processing area	General specification input voltage	General specification power consumption (under processing)	General specification maximum pulse energy	General specifications Environmental resistance peripheral temperature	General specifications Use of environment -resistant peripheral humidity	General specification device body weight	General specifications attached equipment	General specification equipment conditions	Processing applications	Materials to be processed metal sheet metal foil	Processing material fragile material	Use 5g	Application Mobile touch panel	Use battery (battery)	Applicable electronic components	Application car
	TLFD-100	Available upon quote	Fiber laser	100 (W)	1.0 (MJ)	1,064 (NM)	Variable 20/30/60/120 (NSEC)	50 ~ 1,000 (KHz) (pulse width 20or30nsec)	± 1 μm (scanning area 100 × 100nm)	Up to 3,000mm/sec or more	Custom supportable	Single -phase AC100 ~ 240V50/60Hz	700va	1.0 (MJ)	15 ~ 30 ° C	70%RH or less without condensation	Approximately 18kg (head part)	Control box, embedded PC	Dust, toxic gas, water drops, oil, electromagnetic waves, indoor rooms	Copper foil thickness 50 μm cut, stainless steel thickness 50 μm cut, aluminum thickness is 40 μm precision cut, ceramic hole diameter 300 μm, hairpin enamel peeling, circuit formation 30 μm pitch, metal thin film pattern putting 30 μm pitch, metal paste putterning 30 μm pitch, copper thickness 50 μm diameter 300 μm. , AI thickness 40 μm hole diameter 300 μm, aluminum thickness 40 μm hole diameter 300 μm, copper surface paint trimming, transparent conductive film pattern patterning 30 μm pitch, aluminum thickness is 40 μm, copper thickness is 100 μm, and aluminum thickness is about 100 μm.	Iron, copper, stainless steel, aluminum, steel	Ceramix substrate, silicon substrate, GAN board	Escape of the wire film	Print / marking to parts	Laser cut of electrode metal foil	Print / marking of parts	Removal of motor hairpin