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IR wavelength 100w Pico second laser ultra-short pulse laser processing unit TLFD-100PHandling Company
Takei Electric IndustryImage | Part Number | Price (excluding tax) | Practical examples Ceramics | Practical example glass | Target material fragile material | Target material metal sheet metal foil | Target material resin film | Industry semiconductor/LED | Industry high -performance film | Industry Mobile Touch Panel | Industry display | Industry | Industrial food packaging | Industry medicine |
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TLFD-100P |
Available upon quote |
Cut / surface processing thickness 0.7mm |
Inner marking thickness 1.2mm |
・ Ceramics substrate, silicone substrate, SIC substrate, GAN substrate, glass board |
・ Iron, copper, stainless steel, aluminum, steel |
・ PI (polyimide) ・ PET (polyethylene telephate) ・ PP (polypropylene) ・ PE (polyethylene) ・ COP (ring olefin polymer) ・ TAC (triastylcellulose) ・ PMMA (acrylic) |
・ Film cutting ・ Fine hole drilling ・ Ceramix parts screen ・ Cut / microtation hole |
Laminated film fine hole |
・ Film cutting ・ Fine hole drilling ・ Ceramix parts screen ・ Cut / microtation hole |
・ Clamping film cutting ・ Fine holes ・ Serramix parts screen ・ Cut / microscopic hole |
・ Display film cutting ・ Fine holes ・ Serramix parts screen ・ Cut / microscopic hole |
Packing film fine holes |
・ Medical film disconnection ・ Fine holes ・ Seramix parts screen ・ Cut / microscopic hole |
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