Functional introduction
1. Solddown
The solder moves to a high temperature place, so it gets wet but gets wet. It is a solder from the bottom because it is non -contact.
2. Pressing jigless
Since it can be soldered from below, there is no need to hold down the parts. Contributes to the shortest production of small and multiple types.
3. Heating profile adjustment
The optimal profile such as board patterns and terminals can be realized individually.
・ IH heating intensity: Can be set to 10 to 100%. (0.1 seconds units)
・ Sword setting: Send / return / wait is possible. (0.1 seconds units)
4. High sensor (optional)
In order to detect the warpage of the board and apply correction, the distance between the magnetic intensity and the board is kept constant, and the heating characteristics are stable.
5. IH checker S-COPE (optional)
By regularly measuring heating characteristics, abnormalities are detected and defective products are not generated.
6. Head cleaning (optional)
The flux attached to the GAP part of the magnetic intensity is automatically cleaned to minimize the downtime of the device.
This is the version of our website addressed to speakers of English in
the United States.
If you are a resident of another country, please select the appropriate version of Metoree for your country in the drop-down menu.