Realize the optimal profile individually FA-Series
S-FINX Technologies
About This Product
Functional introduction
1. Heating profile adjustment
Realizes the optimal profile, such as board patterns and terminals
･ IH heating intensity: Can be set to 10 to 100%. (0.1 seconds units)
･ Sword setting: Send / return / wait is possible. (0.1 seconds units)
2. Hikikuda function
By heating the magnetic intensive device horizontally while heating, flat -angle terminals and pads can be heated uniformly.
3. Okuzeda function
At the top of the work, dissolve the solder, approach the solder ball, and use the solder heat to apply it to the work.
It is suitable for soldering a work that is vulnerable to heat (such as a flexible board) because it can control the direct heat effect on the work.
4. High sensor (optional)
In order to detect the warpage of the board and apply correction, the distance between the magnetic intensity and the board is kept constant, and the heating characteristics are stable.
5. IH checker S-COPE (optional)
By regularly measuring heating characteristics, abnormalities are detected and defective products are not generated.
6. Head cleaning (optional)
The flux attached to the GAP part of the magnetic intensity is automatically cleaned to minimize the downtime of the device.
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Product
Realize the optimal profile individually FA-Series
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Handling Company
S-FINX Technologies
1 Models of Realize the optimal profile individually FA-Series
| Product Image | Part Number | Price (excluding tax) |
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Fa-series |
Available upon quote |
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