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  4. Thermophysical property measuring device Optical AC method thermal constant measuring device LaserPIT series (ULVAC Sales Co., Ltd.)
Thermophysical property measuring device Optical AC method thermal constant measuring device LaserPIT series-LaserPIT-R
Thermophysical property measuring device Optical AC method thermal constant measuring device LaserPIT series-ULVAC Sales Co., Ltd.

Thermophysical property measuring device Optical AC method thermal constant measuring device LaserPIT series
ULVAC Sales Co., Ltd.

ULVAC Sales Co., Ltd.'s Response Status

Response Rate

100.0%

Response Time

125.8hours

About This Product

■Summary

Evaluation of in-plane thermal conductivity of various film-like membranes. This device measures the in-plane thermal diffusivity of thin plate materials using the AC method (Angstrom method), which uses alternating current laser irradiation. With high thermal conductivity films, it is also possible to measure sub-micron thin films.

■Applications

・Thermal diffusivity/thermal conductivity measurement of high thermal conductivity thin plate materials (thickness <500μm) such as CVD diamond and aluminum nitride ・Measurement of thermal diffusivity/thermal conductivity of various metal thin plate materials (thickness > 5 μm) such as copper, nickel, and stainless steel ・Thermal diffusivity/thermal conductivity measurement of low thermal conductivity thin plate materials (thickness <500μm) such as glass and resin materials ・Measurement of thermal diffusivity/thermal conductivity of anisotropic and highly thermally conductive graphite sheets (thickness <100μm) and polymer films such as polyimide and PET (thickness>5μm) ・Measurement of thermal conductivity of aluminum nitride thin films, aluminum oxide thin films (100 to 300 nm thick), etc. deposited on glass substrates (30 μm thick) ・Thermal conductivity measurement of a DLC thin film (thickness > 1μm) deposited on a glass substrate (thickness 0.03mm) ・Measurement of thermal conductivity of organic dye thin film (100 to 300 nm thick) deposited on PET substrate (0.1 mm thick) ・Evaluation of various target materials for sputtering

■Features

・Measurement of in-plane thermal diffusivity of a wide range of thin plate materials from diamond to polymers ・Applicable to a wide range of materials such as free-standing sheets, films, wires, and fibers with a thickness of 3 to 500 μm ・Thermal conductivity of thin films with a thickness of 100 nm to 1,000 nm formed on a substrate can be measured using the differential method *Room temperature only

  • Product

    Thermophysical property measuring device Optical AC method thermal constant measuring device LaserPIT series

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1 Models of Thermophysical property measuring device Optical AC method thermal constant measuring device LaserPIT series

Image Part Number Price (excluding tax) Sample dimensions Free-standing thin plate sample Sample dimensions Thin film on substrate Measurement atmosphere Measuring physical properties Temperature range
Thermophysical property measuring device Optical AC method thermal constant measuring device LaserPIT series-Part Number-LaserPIT-R

LaserPIT-R

Available upon quote

Width 2.5~5mm x length 30mm x thickness 3~500μm

Width 2.5~5mm x length 30mm x thickness 100nm~1,000nm

In vacuum (＜0.02Pa)

Thermal diffusivity

Room temperature

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About Company Handling This Product

ULVAC Sales Co., Ltd.

Response Rate

100.0%

Response Time

125.8hrs

  • Japan

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Thermal Conductivity Analyzers
Thermal Conductivity Analyzers　ULVAC Sales Co., Ltd.
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