SPS device Plasman Jr.-CSP-I
SPS device Plasman Jr.-S.S. Alloy Co., Ltd.

SPS device Plasman Jr.
S.S. Alloy Co., Ltd.


About This Product

Plasman Jr. is a small sintering device that can control current, temperature, and load automatically. Equipped with the optional NaviWave system, it is possible to record data during sintering. It can also be used as a hot press by attaching a hot wall inside the chamber. ■Customized style Vacuum pumps, vacuum gauges, thermometers, etc. other than the main unit are available as options. This has made it possible for researchers to create their own original devices. All sintering parameters can be controlled manually, so it is possible to change the temperature, heating/cooling rate, pressing force, holding time, etc. according to the sintering situation. ■Uniquely developed power supply for energized thermal processing Equipped with an inverter power supply. You can choose the maximum current from 500A, 1,000A, or 1,500A. A φ10 sample can be heated up to 1,200℃. ■Hot wall system with indirect heating mechanism In order to eliminate the temperature unevenness of the workpiece, which is often a problem with SPS technology, we have developed an indirect heating mechanism hot wall (HW) system. This not only makes it possible to equalize the temperature of the workpiece, but also allows the device to be used as a hot press by using only the HW. ■Overwhelming advantage in developing advanced new materials ・Trial solidification molding of difficult-to-sinter materials ・Can produce sintered bodies with fine structure ・Can produce homogeneous sintered bodies with uniform composition and density ・Can apply pseudo cyclic press ■Target materials We cover a variety of materials from metals to ceramics. [Typical examples] Carbon, nanophase materials, functionally graded materials, amorphous materials, multi-element materials, high melting point materials, metallic glasses, porous materials, intermetallic compounds, fine ceramics, metals, various alloys, advanced composite materials, polymers, etc. ■Application field It can be applied not only to sintering, but also to joining, molding, synthesis, diffusion bonding, heat treatment, melting, and semi-melting. [Typical examples] Thermoelectric conversion materials, target materials, high thermal conductivity materials, magnetic materials, translucent materials, electronic device materials, cemented carbide, hard tools, mold materials, difficult-to-sinter materials, biocompatible materials, superconducting materials, etc.

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    SPS device Plasman Jr.

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1 Models of SPS device Plasman Jr.

Product Image Part Number Price (excluding tax) Body dimensions Hot wall Material processing atmosphere Maximum load Maximum sintering temperature Power supply/capacity Press control Stroke Temperature measurement Upper and lower electrodes Vacuum chamber Vacuum exhaust equipment Weight
SPS device Plasman Jr.-Part Number-CSP-I

CSP-I

Available upon quote W1,200×D790×H2,300 (mm) 1.0kW Vacuum inert gas 1~4tonf 1,200℃ Inverter DC power supply/500A, 1000A, 1500A Servo motor 0~50mm K thermocouple φ1.6mm Water cooling mechanism SUS vacuum piping port, thermocouple port, HW thermocouple port, 1/8 spare port included Rotary pump Main unit: 230kg Power supply: 50kg (500A), 50kg (1,000A), 100kg (1,500A)

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