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  4. Tabletop manual ball wire & bump bonder MODEL-7700D (HiSOL,Inc.)
Tabletop manual ball wire & bump bonder MODEL-7700D-MODEL-7700D
Tabletop manual ball wire & bump bonder MODEL-7700D-HiSOL,Inc.

Tabletop manual ball wire & bump bonder MODEL-7700D
HiSOL,Inc.

HiSOL,Inc.'s Response Status

Response Rate

100.0%

Response Time

40.5hours

About This Product

■Summary

Model 7700D is a tabletop manual ball wire & bump bonder. Equipped with a new mechanism X-Y-Z 3-axis manipulator (patented) as standard, it has excellent operability and is ideal for research and development. Ball wire bonding can be performed using gold wire with a wire diameter of 13μmφ to 50μmφ. In addition, it can also be used for bump bonding by changing the settings, so it can be used for forming stud bumps during flip chip mounting and for security bonds. It also supports deep access bonding with a maximum depth of 16 mm, so it can be used in a wide range of applications such as optical semiconductor devices and MEMS devices. In addition, due to the original function (firing switch mechanism) of WEST BOND products, there is no need to make any adjustments to match the height of the sample. Easily supports bonding with steps of 5mm or more. The wire feed is controlled by a high-performance air opening/closing clamper, and an ultrasonic wire feed mechanism is also included as standard, achieving a stable tail amount. Initial ball formation after electric torch is stable. By using the ball size controller (optional), the current and time during initial ball formation can be adjusted. Bump bonding from 45μmφ is also possible. Features

■Dual Force

The load of 1ST bond and 2ND bond can be adjusted arbitrarily. Very effective for setting conditions for various bonding samples.

■Security bonding function

It is possible to set a sequence to perform bump bonding after wire bonding. Security bond can be easily applied to the 2ND bond part. Conditions for the security bond part can also be set arbitrarily.

■Stitch bonding (continuous bonding)

Operators can easily perform stitch bonding by simply setting the number of bonds. The number of bonds can be set up to 21 bonds. It is also effective for special wiring such as bump-on-wire.

■Bond counter

It can also be used for production control as it can count the number of times ultrasonic waves are applied. The number of bonds can be set from 500 bonds to 30,000 bonds in 500 bond steps.

■High versatility

We can also handle special bonding such as copper wire, silver wire, and Pt wire.

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    Tabletop manual ball wire & bump bonder MODEL-7700D

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1 Models of Tabletop manual ball wire & bump bonder MODEL-7700D

Image Part Number Price (excluding tax) Ultrasonic wire feed mechanism Ultrasonic power Ultrasound time Load Special wire How to operate Frequency Wire Bond counter Bonding method Firing switch mechanism Bump bonding function Dual force mechanism Security bonding function Stitch bonding
Tabletop manual ball wire & bump bonder MODEL-7700D-Part Number-MODEL-7700D

MODEL-7700D

Available upon quote

Setting range is the same as ultrasonic power

High Power setting: max. 4W
Low power setting: max. 2W

0~999ms Can be set in 1ms increments

18g~90g (adjustable)

Compatible with Pt wire, Ag wire, Cu wire, etc.

X-Y-Z 3-axis manipulator (patented)

63KHz

Gold wire from 13μmφ to 50μmφ

500~30,000 bonds Can be set in increments of 500 bonds

TC or thermosonic method

Standard equipment No need to adjust the height of the bonding surface

Standard equipment

Loads for 1ST bond and 2ND bond can be set individually.

Standard equipment

Can be set from 1 to 21 bonds (maximum 20 loop bonding)

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About Company Handling This Product

HiSOL,Inc.

Response Rate

100.0%

Response Time

40.5hrs

Company Overview

Hisol Inc., established in 1967 as Kan Electronics, is a manufacturer based in Tokyo, Japan, producing machine...

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  • Japan

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