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  2. Semiconductor Manufacturing
  3. Semiconductor Lithography Equipment
  4. Achieving maskless microfabrication support for 65nm node and beyond Electron beam exposure system F3000 (Advantest Co., Ltd.)
Achieving maskless microfabrication support for 65nm node and beyond Electron beam exposure system F3000-F3000
Achieving maskless microfabrication support for 65nm node and beyond Electron beam exposure system F3000-Advantest Co., Ltd.

Achieving maskless microfabrication support for 65nm node and beyond Electron beam exposure system F3000
Advantest Co., Ltd.

Advantest Co., Ltd.'s Response Status

Response Rate

100.0%

Response Time

22.7hours

Relatively Fast Response

About This Product

■Features

・Achieving high-mix, low-volume production without masks at low cost and short TAT ・Supports miniaturization after 65nm node ・Achieving high throughput with block exposure

■Realizes low cost and short TAT by maskless

With the currently mainstream optical exposure method, the increasing cost of optical masks due to advances in miniaturization and the lengthening of the SoC development period due to the increase in the number of days required to manufacture masks are becoming more serious problems. Electron beam exposure equipment directly writes onto the wafer without using a photomask (maskless), reducing the burden of masks and achieving low cost and short TAT when producing a wide variety of products in small quantities.

■Supports miniaturization after 65nm node

In addition to the high-resolution electron optical system and functions that have been developed over the years to achieve high reliability and high availability, the F3000 has undergone various improvements such as the adoption of a highly rigid body. This improves exposure position accuracy and dimensional accuracy, which are issues with pattern miniaturization, and supports miniaturization at the 65 nm node and beyond. Achieving high throughput with block exposure The F3000 uses a method that extracts a group of frequently repeated patterns during exposure and irradiates the wafer with an electron beam in each unit (block). This makes it possible to significantly reduce the number of electron beam irradiations and achieves high throughput compared to the conventional method in which each pattern is irradiated individually.

  • Product

    Achieving maskless microfabrication support for 65nm node and beyond Electron beam exposure system F3000

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1 Models of Achieving maskless microfabrication support for 65nm node and beyond Electron beam exposure system F3000

Image Part Number Price (excluding tax)
Achieving maskless microfabrication support for 65nm node and beyond Electron beam exposure system F3000-Part Number-F3000

F3000

Available upon quote

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About Company Handling This Product

Advantest Co., Ltd.

Response Rate

100.0%

Response Time

22.7hrs

  • Japan

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Semiconductor Lithography Equipment
Semiconductor Lithography Equipment　Advantest Co., Ltd.
Advantest Co., Ltd.

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