Hard brittle material wafer asser
JTET Machine System
About This Product
The angle error in the crystal direction is corrected, and grinding can be grinded for each wafer.
This is a high -precision mirror surface processing machine that can be used to the grinding data for each piece and can be replaced from the wrap board.
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Product
Hard brittle material wafer asser
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Handling Company
JTET Machine System
1 Models of Hard brittle material wafer asser
| Product Image | Part Number | Price (excluding tax) | Floor area W x D [mm] | Mass [kg] | Processing range O.D. (max.) [Mm] | Processing range T (max.) [Mm] | Toshi Dimension O.D. (Max.) [MM] |
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R631DF |
Available upon quote | 1,610 x 2,520 | 6,000 | φ200 | 2.5 | φ305 |
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About Company Handling This Product
- Japan
- Since 1961
- 2,547 employees