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Hard brittle material wafer asser-R631DF
Hard brittle material wafer asser-JTET Machine System

Hard brittle material wafer asser
JTET Machine System

JTET Machine System's Response Status

Response Rate

100.0%

Response Time

44.6hours


About This Product

The angle error in the crystal direction is corrected, and grinding can be grinded for each wafer. This is a high -precision mirror surface processing machine that can be used to the grinding data for each piece and can be replaced from the wrap board.

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    Hard brittle material wafer asser

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1 Models of Hard brittle material wafer asser

Image Part Number Price (excluding tax) Processing range O.D. (max.) [Mm] Processing range T (max.) [Mm] Toshi Dimension O.D. (Max.) [MM] Floor area W x D [mm] Mass [kg]
Hard brittle material wafer asser-Part Number-R631DF

R631DF

Available upon quote

φ200

2.5

φ305

1,610 x 2,520

6,000

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About Company Handling This Product

Response Rate

100.0%


Response Time

44.6hrs

Company Overview

JTET Machine System, established in 1961 and headquartered in Osaka, Japan, is a manufacturer and supplier of ...

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  • Japan

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