Silicon wafer assertion board
JTET Machine System
About This Product
These three steps (lap + one -sided grinding + one -sided grinding) of the production line have been consolidated.
Grinding is possible for each wafer on both sides, and for grinding data for each piece.
It is compatible with Waha Transport OHT, and is "overwhelming dominance" rather than the wrap board.
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Product
Silicon wafer assertion board
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Handling Company
JTET Machine System
1 Models of Silicon wafer assertion board
| Product Image | Part Number | Price (excluding tax) | Floor area W x D [mm] | Mass [kg] | Processing range O.D. (max.) [Mm] | Toshi Dimension O.D. (Max.) [MM] |
|---|---|---|---|---|---|---|
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DXSG320 |
Available upon quote | 1,900 x 2,560 | 5,000 | φ200 / φ300 | φ110 / φ160 |
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About Company Handling This Product
- Japan
- Since 1961
- 2,547 employees