IH spot reflow system N-TKG TALL
Wonder Future Corporation Co., Ltd.
About This Product
■Simple experimental equipment single head specification
Enables soldering on non-heat resistant materials and high heat dissipation boards.
■Features
・Only the metal parts are heated using IH (electromagnetic induction principle). (Multi-stage heating possible)
・Equipped with either head for FPCB bonding or component bonding (selectable at time of order)
- Enables soldering on non-heat resistant materials. PET, PBT, cloth, 3D MIDI, etc.
・Spot heating is also possible for soldering on 3D shapes and curved surfaces.
・ACF alternative: No need to apply pressure
- Enables soldering on high heat dissipation boards. Hardening of heat dissipation substrates (Al, Cu, etc.) and die bond materials for power semiconductors, etc.
・Laser replacement: No solder scattering, no sudden temperature rise. Automation of manual soldering
・Realizes energy and space savings.
・Ordinary solder can be used
・It can also be applied to thermosetting resins other than solder.
■Application
・Resin touch panel
・RF-ID
・3D-MID
・Wearable
・LCD backlight
・Rework
・Power semiconductor die bond
■Implementation example
・Joining FPCB with resin touch panel. Compatible with 3D and curved surfaces
・Soldering parts such as LEDs on PET, cloth, and paper
・3D MID
・LED mounting on heat dissipation board (AL)
■Work size (reference)
・FPCB:50×50mm
・Electronic parts: 1,005 chips
■Heatable circuit (reference)
・Mouth shape: min.□0.5mm
・Circuit width: min.W=0.3mm
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Product
IH spot reflow system N-TKG TALL
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Handling Company
Wonder Future Corporation Co., Ltd.
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Categories
1 Models of IH spot reflow system N-TKG TALL
| Product Image | Part Number | Price (excluding tax) | Body outline | Body weight | Head specifications | Heating method | Induction heating power supply | Stage size |
|---|---|---|---|---|---|---|---|---|
|
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N-TKG TALL |
Available upon quote | W650×D870×H1,430mm | 100kg | Optional (for FPC/electronic parts) | 10 step step cure | 3.5kVA, AC200V, 20A | W200×D200mm/W10×L25mm |
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