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  4. A flexible solution for plasma-enhanced chemical vapor deposition processes PlasmaPro 800 PECVD (Oxford Instruments Ltd.)
A flexible solution for plasma-enhanced chemical vapor deposition processes PlasmaPro 800 PECVD-PlasmaPro 800 PECVD
A flexible solution for plasma-enhanced chemical vapor deposition processes PlasmaPro 800 PECVD-Oxford Instruments Ltd.

A flexible solution for plasma-enhanced chemical vapor deposition processes PlasmaPro 800 PECVD
Oxford Instruments Ltd.

Oxford Instruments Ltd.'s Response Status

Response Rate

100.0%

Response Time

26.3hours

Relatively Fast Response

About This Product

The PlasmaPro 800 provides a flexible solution for plasma-enhanced chemical vapor deposition (PECVD) processes for large wafer batches and 300mm wafers in a compact footprint and open-load system. Equipped with a 460 mm diameter table, it accommodates full size 300 mm or large batches of 43 x 50 mm (2”), providing a complete manufacturing solution and a proven market-leading product.

■Features

・High performance process ・Excellent substrate temperature control ・High precision process control ・Proven 300 mm single wafer failure analysis process option

■PlasmaPro 800 PECVD

-Designed to produce high performance homogeneous insulating thin films. - Selectable or mixed high and low frequency plasma power supplies allow for stress control in PECVD, allowing the deposited film to be tuned for tensile compression or low stress.

■PlasmaPro 800 RIE

This dry etching technology has a proven track record and is widely used throughout the industry.

  • Product

    A flexible solution for plasma-enhanced chemical vapor deposition processes PlasmaPro 800 PECVD

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1 Models of A flexible solution for plasma-enhanced chemical vapor deposition processes PlasmaPro 800 PECVD

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A flexible solution for plasma-enhanced chemical vapor deposition processes PlasmaPro 800 PECVD-Part Number-PlasmaPro 800 PECVD

PlasmaPro 800 PECVD

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Oxford Instruments Ltd.

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Response Time

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