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  4. Isotropic and anisotropic dry etching PlasmaPro 100 RIE compatible with a wide range of processes (Oxford Instruments Ltd.)
Isotropic and anisotropic dry etching PlasmaPro 100 RIE compatible with a wide range of processes-PlasmaPro 100 RIE
Isotropic and anisotropic dry etching PlasmaPro 100 RIE compatible with a wide range of processes-Oxford Instruments Ltd.

Isotropic and anisotropic dry etching PlasmaPro 100 RIE compatible with a wide range of processes
Oxford Instruments Ltd.

Oxford Instruments Ltd.'s Response Status

Response Rate

100.0%

Response Time

26.3hours

Relatively Fast Response

About This Product

The PlasmaPro 100 RIE module provides isotropic and anisotropic dry etching for a wide range of processes. Suitable for research and manufacturing customers, loadlock and cassette options provide a controlled environment for improved process reproducibility.

■Features

・Compatible with all wafers up to 200 mm ・Single wafer or batch process with excellent process control ・Highly precise control of gas and plasma power ・Quick exchange of wafers of different sizes is possible ・Both low ownership cost and maintainability ・Excellent homogeneity, high throughput and high precision processes possible ・In-situ chamber cleaning and termination determination possible ・Wide electrode temperature range, -150℃ to 400℃

■Cluster load lock option

・Clustering is possible using up to 4* process modules including NULLALD, ALE, ICP, CVD, PECVD, ion beam etching, and ion beam deposition equipment Load single wafers directly into the central handling unit or via an optional loading station (required for wall installation) ・Multiple chambers can be operated at the same time, and processed wafers can be kept in the chamber until the load station reaches a vacuum state.

■Operating conditions

・5～500mTorr operating pressure ・0.1~1.5 W/cm2 power density ・Total gas flow rate from 5 to 200 sccm ・Apply DC bias of 30 to 800 V to the bottom electrode -Substrate is typically mounted on a quartz or graphite cover plate

■Advanced load lock options

・Arm position control: Stepping motor ・Opening: The front is held by a gas strut with a locking mechanism. ・Wafer tracking: Yes ・Size: Compact with width +80 mm and length +90 mm. Suitable for 200 mm wafers ・Recommended: Applications where positional accuracy is important ・Not recommended: Transparent substrate

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    Isotropic and anisotropic dry etching PlasmaPro 100 RIE compatible with a wide range of processes

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1 Models of Isotropic and anisotropic dry etching PlasmaPro 100 RIE compatible with a wide range of processes

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Isotropic and anisotropic dry etching PlasmaPro 100 RIE compatible with a wide range of processes-Part Number-PlasmaPro 100 RIE

PlasmaPro 100 RIE

Available upon quote

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About Company Handling This Product

Oxford Instruments Ltd.

Response Rate

100.0%

Response Time

26.3hrs

  • Japan

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