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  4. Single wafer ICP RIE etching system PlasmaPro 100 Polaris ICP RIE (Oxford Instruments Ltd.)
Single wafer ICP RIE etching system PlasmaPro 100 Polaris ICP RIE-PlasmaPro 100 Polaris ICP RIE
Single wafer ICP RIE etching system PlasmaPro 100 Polaris ICP RIE-Oxford Instruments Ltd.

Single wafer ICP RIE etching system PlasmaPro 100 Polaris ICP RIE
Oxford Instruments Ltd.

Oxford Instruments Ltd.'s Response Status

Response Rate

100.0%

Response Time

25.0hours

Relatively Fast Response

About This Product

PlasmaPro 100 Polaris is a single-wafer etch system that provides a smart solution with the etch performance you need to stay competitive. Designed specifically for the chemical resistance needed to etch hard materials such as GaN, sapphire, and SiC, the PlasmaPro 100 Polaris provides fast, uniform etching on wafers up to 200 mm diameter. .

■Features

・Active cooling electrode: allows sample temperature control during the etching process ・High-power ICP source: Generation of high-density plasma ・Highly reliable hardware and high maintainability: Achieving excellent availability ・Magnetic spacer: Improves ion control and uniformity ・Unique electrostatic clamping technology: Capable of clamping sapphire substrates, sapphire substrates coated with GaN, and silicon substrates. ・Chamber liner with heater: Optimized to reduce deposition on chamber inner walls ・Advanced Auto Matching Unit (AMU): Enables fast, efficient and accurate matching, achieving excellent process reproducibility

  • Product

    Single wafer ICP RIE etching system PlasmaPro 100 Polaris ICP RIE

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1 Models of Single wafer ICP RIE etching system PlasmaPro 100 Polaris ICP RIE

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Single wafer ICP RIE etching system PlasmaPro 100 Polaris ICP RIE-Part Number-PlasmaPro 100 Polaris ICP RIE

PlasmaPro 100 Polaris ICP RIE

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About Company Handling This Product

Oxford Instruments Ltd.

Response Rate

100.0%

Response Time

25.0hrs

  • Japan

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Etching Equipment　Oxford Instruments Ltd.
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