PINK's new sintering technology
Highly reliable heat -resistant sintering joining
PINK has developed a new sintering system using silver paste, especially as a request from the current electronic device field, especially to improve durability, reliability, and heat resistance. Silver paste sintering is an excellent technology replacing the conventional (soldering) technology of high -performance electronic devices.
By using a PINK sinning system, we can sintered bonding that realizes reliability, durability, and heat -resistant bonding. Laring the target product surface can use various materials for the product, making the process easier.
◆ Flexible synching system SIN 200+ High -confidence, high thermal conductivity joining
Patent acquisition Sin 200+ is suitable for diverse manufacturing requirements from laboratory level to mass production. It can be used with a flexible modular structure and can be operated on a batch -type system equipped with a different pre -heating (preliminary heating of the product) and////cooling or an automated inline.
The substrate temperature, air pressure and process gas of the vacuum chamber during heating, sintering, and cooling can be controlled accurately. The dynamic pressure adaptability of the system expands the possibility of new production.
The sintered module Sin 200+ can be operated as a batch system, but can also be integrated as an option.
Sin 200+, an automatic inline system, connects to sintered modules and external cooling modules, and has a circulatory transportation mechanism through the system.
There is also a module for preliminary heating.
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