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  4. Attachment plasma unit Tough Plasma FPF20-GM/FPF20-ST (FUJI CORPORATION)

Attachment plasma unit Tough Plasma FPF20-GM/FPF20-ST
FUJI CORPORATION

About This Product

Attotive pressure plasma device that can be used for adhesive pre -treatment and oil cleaning The Tough Plasma can generate the world's highest level of high -density radicals, and has a low temperature among the atmospheric pressure plasma devices. It can be modified at high speed without damaging the thin film surface such as resin materials and films that is vulnerable to heat, and is widely used in the adhesion / joining fields of difficulty -covered materials and heterogeneous materials, painting / coating pre -treatment, and dry cleaning fields. In addition, it is equipped with the monitoring functions required to be used in the inline, and it has excellent ease of use and conservatives. ◆ High -speed processing with high processing power Dramatic tact reduction by ultra -high density plasma processing FUJI's proprietary technology has achieved high -density plasma irradiation while keeping the plasma state. For this reason, the processing capacity tends to be thinner the faster, but it can be expected to be highly effective even if the processing is performed at a fast speed, and the tact can be reduced. ◆ Quality collateral by monitoring function Stop immediately if there is an abnormality. Prevents deficient processing outfit You can monitor the plasma status from all numbers, stop the device if there is an abnormality, and collater for the quality. Monitoring place ･ Flow of irradiation gas ･ Clogging of plasma irradiation parts ･ Current status when plasma occurs ･ Cutting power line * The range that can be monitored varies depending on the product ◆ Collapse by low -temperature processing Safe even materials that are vulnerable to heat Tough Plasma is designed so that the heat -vented resin material can be irradiated with confidence. It can be used with confidence for thermoplastic resin and thin film resin film. ◆ About plasma gas temperature The plasma gas temperature is the saturate temperature (maximum temperature) when the plasma head is fixed and continues to irradiate. When actually using it, it irradiates at a speed of several hundred mm/s according to the customer's process, so it will be much lower than the graph temperature.

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    Attachment plasma unit Tough Plasma FPF20-GM/FPF20-ST

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0 Models of Attachment plasma unit Tough Plasma FPF20-GM/FPF20-ST

Image Part Number Price (excluding tax) Tip nozzle/wide nozzle Process gas/flow rate/air Standard certification power consumption Dimensions (L × W × H)/Head Dimensions (L x W x H)/Controller Mass/head Mass/controller Mass/drive power supply

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About Company Handling This Product

FUJI CORPORATION

Company Overview

FUJI CORPORATION was established in 1959 and is a manufacturer of electronic assembly equipments and machine t...

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