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  2. Semiconductor manufacturing equipment Capper free metal bond shaft wheels (TOKYO DIAMOND TOOLS MFG.CO.,LTD.)
Semiconductor manufacturing equipment Capper free metal bond shaft wheels-Copper -free metal bond axis wheel
Semiconductor manufacturing equipment Capper free metal bond shaft wheels-TOKYO DIAMOND TOOLS MFG.CO.,LTD.

Semiconductor manufacturing equipment Capper free metal bond shaft wheels
TOKYO DIAMOND TOOLS MFG.CO.,LTD.

About This Product

It is a wheel with a copper -less metal bond axis that does not use copper, which restricts the use of copper and steel in the bond. "Copper -free" wheels have realized mechanical characteristics comparable to bronze bonds without using copper by containing their own bonds. In the processing test, it has grinding and life as comparable to bronze bonds. By using a capper -free wheel, it is possible to suppress copper contamination into processing work, especially when processing jigs used in the pre -semiconductor process that dislikes copper contamination, and reduces the cleaning and removal process in the post process. Masu.

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    Semiconductor manufacturing equipment Capper free metal bond shaft wheels

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1 Models of Semiconductor manufacturing equipment Capper free metal bond shaft wheels

Image Part Number Price (excluding tax) Bond type
Semiconductor manufacturing equipment Capper free metal bond shaft wheels-Part Number-Copper -free metal bond axis wheel

Copper -free metal bond axis wheel

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Metal bond

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About Company Handling This Product

TOKYO DIAMOND TOOLS MFG.CO.,LTD.

Company Overview

Tokyo Diamond Tools Mfg. Co., Ltd. is a diamond tools manufacturer established in 1932 and based in Tokyo, Jap...

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