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  2. Compound semiconductor Waha plane for grinding "Tough air" Polished Metal Bond Wheel (TOKYO DIAMOND TOOLS MFG.CO.,LTD.)
Compound semiconductor Waha plane for grinding "Tough air" Polished Metal Bond Wheel-Tough air
Compound semiconductor Waha plane for grinding "Tough air" Polished Metal Bond Wheel-TOKYO DIAMOND TOOLS MFG.CO.,LTD.

Compound semiconductor Waha plane for grinding "Tough air" Polished Metal Bond Wheel
TOKYO DIAMOND TOOLS MFG.CO.,LTD.

About This Product

■ Realizes high grinding and long life by processing sapphires and SIC substrates.

・ Introduced a porous tissue in metal bonds, enhanced food to improve grinding properties, and achieve long life by improving heat dissipation. ・ In addition to the wear resistance of high rigidity metal bonds, it realizes sharpness by moderate self -launched blade ・ Long life will stabilize the processing quality and contribute to the reduction of processing costs.

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    Compound semiconductor Waha plane for grinding "Tough air" Polished Metal Bond Wheel

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1 Models of Compound semiconductor Waha plane for grinding "Tough air" Polished Metal Bond Wheel

Image Part Number Price (excluding tax)
Compound semiconductor Waha plane for grinding "Tough air" Polished Metal Bond Wheel-Part Number-Tough air

Tough air

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About Company Handling This Product

TOKYO DIAMOND TOOLS MFG.CO.,LTD.

Company Overview

Tokyo Diamond Tools Mfg. Co., Ltd. is a diamond tools manufacturer established in 1932 and based in Tokyo, Jap...

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