Excellent heat dissipation aluminum base plate SL-AC series-SL-AC insulating layer 80 [μm]
Excellent heat dissipation aluminum base plate SL-AC series-Nitto El Material Co., Ltd.

Excellent heat dissipation aluminum base plate SL-AC series
Nitto El Material Co., Ltd.


About This Product

An aluminum base plate with excellent heat dissipation that is replaced with a glass epoxy wiring board. One of the tasks of electronic devices that are becoming smaller and high performance is an important point that affects the product design of the heat generated from the mounted element. For this reason, a better printed wiring plate with better heat dissipation has been required, and the "metal substrate", which has a good thermal conductivity replaced by a conventional glass epoxy wiring plate, has been attracting attention and is widely used. Above all, it is an intelligent power module (IPM) substrate (IPM), which integrates the "power part" that converts commercial current to a DC and converts it to a variable voltage and variable frequency, and a "driving control unit" that controls the motor rotation. Many aluminum boards of Nitto Shinko are used. ■ Features ・ Excellent heat conductivity. ・ Excellent heat resistance. (330 ℃ x 2min. Or more) ・ It is excellent in flash resistance. (UL-94V-O acquisition) ・ Excellent power voltage. ■ Use ・ Power module substrate (PowerTransista, inverter, Sirista) ・ Switching power supply board. ・ Automobile electrical board. ・ LED installation board.

  • Product

    Excellent heat dissipation aluminum base plate SL-AC series




*Please note that we may not be able to accommodate sample requests.

7 Models of Excellent heat dissipation aluminum base plate SL-AC series

Items marked with have different values ​​depending on the model number.

Click on the part number for more information about each product

Product Image Part Number Price (excluding tax) Configuration aluminum thickness (mm) Configuration copper foil (μm) Distribution rate (1MHz) Insulated destructive voltage (KV) Power voltage for one minute (KV) Thermal conductivity w/mk Thermal resistance C/W
Excellent heat dissipation aluminum base plate SL-AC series-Part Number-SL-AC insulating layer 80 [μm]

SL-AC insulating layer 80 [μm]

Available upon quote 1 35 4.5 8 5.5 1 0.52
Excellent heat dissipation aluminum base plate SL-AC series-Part Number-SL-AC insulating layer 125 [μm]

SL-AC insulating layer 125 [μm]

Available upon quote 2 105 4.5 12 9 1 0.8
Excellent heat dissipation aluminum base plate SL-AC series-Part Number-SL-AC (L) Insulated layer 100 [μm]

SL-AC (L) Insulated layer 100 [μm]

Available upon quote 2 105 4.6 Ten 6.5 1.8 0.48
Excellent heat dissipation aluminum base plate SL-AC series-Part Number-SL-AC-H Insulated layer 125 [μm]

SL-AC-H Insulated layer 125 [μm]

Available upon quote 2 105 7.2 8 6.5 1.9 0.55
Excellent heat dissipation aluminum base plate SL-AC series-Part Number-SL-AC-H Insulated layer 150 [μm]

SL-AC-H Insulated layer 150 [μm]

Available upon quote 2 70 7.2 9 7 1.9 0.65
Excellent heat dissipation aluminum base plate SL-AC series-Part Number-SL-AC-H (L) Insulated layer 125 [μm]

SL-AC-H (L) Insulated layer 125 [μm]

Available upon quote 2 105 7.5 7.5 4.5 3.5 0.35
Excellent heat dissipation aluminum base plate SL-AC series-Part Number-SL-AC-H (L) Insulated layer 150 [μm]

SL-AC-H (L) Insulated layer 150 [μm]

Available upon quote 2 70 7.5 8 Five 3.5 0.43

Click on the part number for more information about each product

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