Hard-curing adhesive that can be used at extremely low temperature SK-229
Nitto El Material Co., Ltd.
About This Product
An epoxy -based 2 -liquid -curing adhesive with adhesive function even in the extremely low temperature region.
■ Features
・ The temperature area is wide from extremely low temperature to room temperature
・ Excellent heat -resistant shock
■ Use
・ Low temperature range (up to -196 ° C): LNG -related, medical frozen equipment related, space -related
・ Low temperature ranges (low temperature below -196 ° C): Superthritical radiation -related, liquid nitrogen -related
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Product
Hard-curing adhesive that can be used at extremely low temperature SK-229
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Handling Company
Nitto El Material Co., Ltd.
3 Models of Hard-curing adhesive that can be used at extremely low temperature SK-229
Items marked with have different values depending on the model number.
Click on the part number for more information about each product
| Product Image | Part Number | Price (excluding tax) | Curing conditions | Experimental temperature used | Gelization time@100 ℃ | Hardening shrinkage | Iight @ 20 ℃ | Mixed ratio (weight ratio) | Pot Life (RT) | Vehicle @ 25 ° C | base | color |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
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SK-229 main drug |
Available upon quote | ー | ー | ー | ー | 1.4 | 1 | ー | 80pa-s | Epoxy system | Blue |
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SK-229 hardening agent |
Available upon quote | ー | ー | ー | ー | 1.3 | 1 | ー | 100pa-s | Amine | yellow |
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SK-229 mixture |
Available upon quote | 20 ~ 100˚c case: 24 ° C x 24 hours, 100˚C x 60 minutes | -269 ~ 80˚C | Within 10 minutes | 2 or less | 1.4 | ー | 120 minutes | 80 ~ 90pa-s | ー | green |
Click on the part number for more information about each product
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About Company Handling This Product
- Japan
- Since 1979