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  3. Metal Base Substrates
  4. Excellent heat dissipation aluminum base plate SL-AC series (Nitto El Material Co., Ltd.)
Excellent heat dissipation aluminum base plate SL-AC series-SL-AC insulating layer 80 [μm]
Excellent heat dissipation aluminum base plate SL-AC series-Nitto El Material Co., Ltd.

Excellent heat dissipation aluminum base plate SL-AC series
Nitto El Material Co., Ltd.

Nitto El Material Co., Ltd.'s Response Status

Response Rate

100.0%

Response Time

18.2hours

Company Review

5.0

Relatively Fast Response

About This Product

An aluminum base plate with excellent heat dissipation that is replaced with a glass epoxy wiring board. One of the tasks of electronic devices that are becoming smaller and high performance is an important point that affects the product design of the heat generated from the mounted element. For this reason, a better printed wiring plate with better heat dissipation has been required, and the "metal substrate", which has a good thermal conductivity replaced by a conventional glass epoxy wiring plate, has been attracting attention and is widely used. Above all, it is an intelligent power module (IPM) substrate (IPM), which integrates the "power part" that converts commercial current to a DC and converts it to a variable voltage and variable frequency, and a "driving control unit" that controls the motor rotation. Many aluminum boards of Nitto Shinko are used.

■ Features

・ Excellent heat conductivity. ・ Excellent heat resistance. (330 ℃ x 2min. Or more) ・ It is excellent in flash resistance. (UL-94V-O acquisition) ・ Excellent power voltage.

■ Use

・ Power module substrate (PowerTransista, inverter, Sirista) ・ Switching power supply board. ・ Automobile electrical board. ・ LED installation board.

  • Product

    Excellent heat dissipation aluminum base plate SL-AC series

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7 Models of Excellent heat dissipation aluminum base plate SL-AC series

Click on the part number for more information about each product

Image Part Number Price (excluding tax) Configuration copper foil (μm) Configuration aluminum thickness (mm) Insulated destructive voltage (KV) Power voltage for one minute (KV) Distribution rate (1MHz) Thermal resistance C/W Thermal conductivity w/mk
Excellent heat dissipation aluminum base plate SL-AC series-Part Number-SL-AC insulating layer 80 [μm]

SL-AC insulating layer 80 [μm]

Available upon quote

35

1

8

5.5

4.5

0.52

1

Excellent heat dissipation aluminum base plate SL-AC series-Part Number-SL-AC insulating layer 125 [μm]

SL-AC insulating layer 125 [μm]

Available upon quote

105

2

12

9

4.5

0.8

1

Excellent heat dissipation aluminum base plate SL-AC series-Part Number-SL-AC (L) Insulated layer 100 [μm]

SL-AC (L) Insulated layer 100 [μm]

Available upon quote

105

2

Ten

6.5

4.6

0.48

1.8

Excellent heat dissipation aluminum base plate SL-AC series-Part Number-SL-AC-H Insulated layer 125 [μm]

SL-AC-H Insulated layer 125 [μm]

Available upon quote

105

2

8

6.5

7.2

0.55

1.9

Excellent heat dissipation aluminum base plate SL-AC series-Part Number-SL-AC-H Insulated layer 150 [μm]

SL-AC-H Insulated layer 150 [μm]

Available upon quote

70

2

9

7

7.2

0.65

1.9

Excellent heat dissipation aluminum base plate SL-AC series-Part Number-SL-AC-H (L) Insulated layer 125 [μm]

SL-AC-H (L) Insulated layer 125 [μm]

Available upon quote

105

2

7.5

4.5

7.5

0.35

3.5

Excellent heat dissipation aluminum base plate SL-AC series-Part Number-SL-AC-H (L) Insulated layer 150 [μm]

SL-AC-H (L) Insulated layer 150 [μm]

Available upon quote

70

2

8

Five

7.5

0.43

3.5

Click on the part number for more information about each product

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About Company Handling This Product

Nitto El Material Co., Ltd.

Response Rate

100.0%

Response Time

18.2hrs

Company Review

5.0
  • Japan

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Metal Base Substrates
Metal Base Substrates　Nitto El Material Co., Ltd.
Nitto El Material Co., Ltd.

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