Hard-curing adhesive that can be used at extremely low temperature SK-229-SK-229 main drug
Hard-curing adhesive that can be used at extremely low temperature SK-229-Nitto El Material Co., Ltd.

Hard-curing adhesive that can be used at extremely low temperature SK-229
Nitto El Material Co., Ltd.


About This Product

An epoxy -based 2 -liquid -curing adhesive with adhesive function even in the extremely low temperature region. ■ Features ・ The temperature area is wide from extremely low temperature to room temperature ・ Excellent heat -resistant shock ■ Use ・ Low temperature range (up to -196 ° C): LNG -related, medical frozen equipment related, space -related ・ Low temperature ranges (low temperature below -196 ° C): Superthritical radiation -related, liquid nitrogen -related

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    Hard-curing adhesive that can be used at extremely low temperature SK-229

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3 Models of Hard-curing adhesive that can be used at extremely low temperature SK-229

Items marked with have different values depending on the model number.

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Product Image Part Number Price (excluding tax) Curing conditions Experimental temperature used Gelization time@100 ℃ Hardening shrinkage Iight @ 20 ℃ Mixed ratio (weight ratio) Pot Life (RT) Vehicle @ 25 ° C base color
Hard-curing adhesive that can be used at extremely low temperature SK-229-Part Number-SK-229 main drug

SK-229 main drug

Available upon quote 1.4 1 80pa-s Epoxy system Blue
Hard-curing adhesive that can be used at extremely low temperature SK-229-Part Number-SK-229 hardening agent

SK-229 hardening agent

Available upon quote 1.3 1 100pa-s Amine yellow
Hard-curing adhesive that can be used at extremely low temperature SK-229-Part Number-SK-229 mixture

SK-229 mixture

Available upon quote 20 ~ 100˚c case: 24 ° C x 24 hours, 100˚C x 60 minutes -269 ~ 80˚C Within 10 minutes 2 or less 1.4 120 minutes 80 ~ 90pa-s green

Click on the part number for more information about each product

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