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  4. Maskless exposure equipment Reduce cycle time for semiconductor device prototyping with direct writing using DMD Maskless exposure equipment ME-120F (PMT Co., Ltd.)
Maskless exposure equipment Reduce cycle time for semiconductor device prototyping with direct writing using DMD Maskless exposure equipment ME-120F-ME-120F
Maskless exposure equipment Reduce cycle time for semiconductor device prototyping with direct writing using DMD Maskless exposure equipment ME-120F-PMT Co., Ltd.

Maskless exposure equipment Reduce cycle time for semiconductor device prototyping with direct writing using DMD Maskless exposure equipment ME-120F
PMT Co., Ltd.

About This Product

The ME-120F maskless exposure system is a device that uses exposure to draw patterns on semiconductor wafers, etc. Direct writing is performed using a display element called a DMD (Digital Micromirror Device), which eliminates the huge cost and time required to produce photomasks, solving the problems associated with conventional photolithography processes. .

■Direct drawing with DMD

A DMD is a display element that consists of tiny mirrors 10-plus µm square arranged in a grid pattern. By illuminating the mirror surface with light from an LED light source and tilting each mirror one by one (ON/OFF control), binarized pattern image data is drawn directly on the board. Since the cost and time required for photomask production are eliminated, prototyping of semiconductor devices can be made more efficiently.

■ Equipped with fine mode to improve jaggies

In addition to the standard exposure mode, a fine exposure mode that uses pixel interpolation technology is included as standard to improve exposure results. Although the throughput time is longer, the data reproducibility of diagonal lines and curves is dramatically improved. It can be used depending on the tact and accuracy and purpose.

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    Maskless exposure equipment Reduce cycle time for semiconductor device prototyping with direct writing using DMD Maskless exposure equipment ME-120F

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1 Models of Maskless exposure equipment Reduce cycle time for semiconductor device prototyping with direct writing using DMD Maskless exposure equipment ME-120F

Image Part Number Price (excluding tax) Exposure ability Exposure method Power supply Weight Overlay accuracy Body dimensions Substrate Resolution Light source Usage environment
Maskless exposure equipment Reduce cycle time for semiconductor device prototyping with direct writing using DMD Maskless exposure equipment ME-120F-Part Number-ME-120F

ME-120F

Available upon quote

400mm2/min (at standard exposure)

Scan exposure method

AC100V (3A)

Approximately 1,300kg

Within ±0.5μm

W2,000 × D1,300 × H2,000mm

Max. □300mm wafer

Standard exposure: 0.5µm/pix, Fine exposure: 0.05µm/pix (x10), 0.10µm/pix (x5), 0.125µm/pix (x4), 0.25µm/pix (x5)

LED (light source wavelength: λ=385nm)

Temperature: 22±1℃, Humidity: 50±10%RH (no condensation)

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PMT Co., Ltd.

  • Japan

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