Plasma products Parallel plate type reduced pressure plasma equipment
Denshi Giken Co., Ltd.
About This Product
■Summary
This is a plasma device that can precisely process substrate surfaces with anisotropy using reactive ion etching (RIE) plasma. We can perform processing unique to anisotropic plasma, such as etching of substrate circuits, desmear at the bottom of fine vias, and sputter cleaning. Of course, plasma etching mode (PE mode) is also available.
■Features
・Can process medium-sized substrates, films, etc. An automatic conveyance system option can also be added.
・Electrode size and RF output specifications can be customized according to the application.
■Application examples
・Various functional group modifications Surface modification treatment (hydrophilic/water repellent/improved adhesion/reduction)
・Pre-plating treatment for various substrates such as fluororesin
・Adhesive-free bonding pretreatment for various substrates such as fluororesin
・Resist ashing/insulating film etching
・Desmear/Descum
・Organic matter removal
・Low temperature sintering
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Product
Plasma products Parallel plate type reduced pressure plasma equipment
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Handling Company
Denshi Giken Co., Ltd.
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Categories
1 Models of Plasma products Parallel plate type reduced pressure plasma equipment
| Product Image | Part Number | Price (excluding tax) |
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Parallel plate type reduced pressure plasma device |
Available upon quote |
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About Company Handling This Product
- Japan