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  4. Heat sink multipurpose, general purpose F series (LSI Cooler Co., Ltd.)
Heat sink multipurpose, general purpose F series-12F31
Heat sink multipurpose, general purpose F series-LSI Cooler Co., Ltd.

Heat sink multipurpose, general purpose F series
LSI Cooler Co., Ltd.

About This Product

We strive to improve the performance of heat sinks and heat sinks. Semiconductor elements (transistors, CPUs, IGBTs, etc.) used in current electrical and electronic devices can destroy the elements themselves due to the heat generated if they are not cooled during operation. A heat sink is a radiator for electronic components that quickly transfers and cools this heat to prevent damage to the device. Most of them consist of a base plate that attaches the heating element and fins that radiate heat from the base plate. Cooling methods can be divided into natural cooling, which uses air convection caused by generated heat, and forced cooling, which uses forced air convection with a fan or a cooling medium such as water. In order to achieve highly efficient heat treatment with a heat sink, LSI coolers continue to pursue higher performance using technology supported by thermal theory.

■Heat sink type

Aluminum extrusion type

■Features

fin type heat sink

  • Product

    Heat sink multipurpose, general purpose F series

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1 Models of Heat sink multipurpose, general purpose F series

Image Part Number Price (excluding tax) Thermal resistance (℃/W) L50 Thermal resistance (℃/W) L150 Thermal resistance (℃/W) L100 Unit weight
Heat sink multipurpose, general purpose F series-Part Number-12F31

12F31

Available upon quote

12.7

5.3

7.3

0.491kg/m

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LSI Cooler Co., Ltd.

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